JPS50122418A - - Google Patents
Info
- Publication number
- JPS50122418A JPS50122418A JP2809974A JP2809974A JPS50122418A JP S50122418 A JPS50122418 A JP S50122418A JP 2809974 A JP2809974 A JP 2809974A JP 2809974 A JP2809974 A JP 2809974A JP S50122418 A JPS50122418 A JP S50122418A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2809974A JPS50122418A (ja) | 1974-03-13 | 1974-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2809974A JPS50122418A (ja) | 1974-03-13 | 1974-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50122418A true JPS50122418A (ja) | 1975-09-26 |
Family
ID=12239336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2809974A Pending JPS50122418A (ja) | 1974-03-13 | 1974-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50122418A (ja) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS54119328A (en) * | 1978-03-10 | 1979-09-17 | Nippon Mining Co Ltd | Copper alloy for lead frames |
| US4460659A (en) * | 1982-07-29 | 1984-07-17 | General Electric Company | Copper alloy welding filler and method of use |
| US4591394A (en) * | 1984-04-17 | 1986-05-27 | Achter Pieter Paul Van | Method for treating copper and for using the thus-treated copper |
| US4755235A (en) * | 1979-07-30 | 1988-07-05 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically conductive precipitation hardened copper alloy and a method for manufacturing the same |
| JPH06279896A (ja) * | 1993-07-19 | 1994-10-04 | Toshiba Corp | 導電性および強度を兼備した銅合金部材 |
| JPH06279895A (ja) * | 1993-07-19 | 1994-10-04 | Toshiba Corp | リード材 |
-
1974
- 1974-03-13 JP JP2809974A patent/JPS50122418A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS6342415B2 (ja) * | 1978-01-25 | 1988-08-23 | Tokyo Shibaura Electric Co | |
| JPS54119328A (en) * | 1978-03-10 | 1979-09-17 | Nippon Mining Co Ltd | Copper alloy for lead frames |
| JPS5839901B2 (ja) * | 1978-03-10 | 1983-09-02 | 日本鉱業株式会社 | リ−ドフレ−ム用の銅合金 |
| US4755235A (en) * | 1979-07-30 | 1988-07-05 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically conductive precipitation hardened copper alloy and a method for manufacturing the same |
| US4460659A (en) * | 1982-07-29 | 1984-07-17 | General Electric Company | Copper alloy welding filler and method of use |
| US4591394A (en) * | 1984-04-17 | 1986-05-27 | Achter Pieter Paul Van | Method for treating copper and for using the thus-treated copper |
| JPH06279896A (ja) * | 1993-07-19 | 1994-10-04 | Toshiba Corp | 導電性および強度を兼備した銅合金部材 |
| JPH06279895A (ja) * | 1993-07-19 | 1994-10-04 | Toshiba Corp | リード材 |