JPS50120272A - - Google Patents

Info

Publication number
JPS50120272A
JPS50120272A JP2525174A JP2525174A JPS50120272A JP S50120272 A JPS50120272 A JP S50120272A JP 2525174 A JP2525174 A JP 2525174A JP 2525174 A JP2525174 A JP 2525174A JP S50120272 A JPS50120272 A JP S50120272A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2525174A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2525174A priority Critical patent/JPS50120272A/ja
Publication of JPS50120272A publication Critical patent/JPS50120272A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
  • Feeding Of Workpieces (AREA)
JP2525174A 1974-03-06 1974-03-06 Pending JPS50120272A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2525174A JPS50120272A (enrdf_load_stackoverflow) 1974-03-06 1974-03-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2525174A JPS50120272A (enrdf_load_stackoverflow) 1974-03-06 1974-03-06

Publications (1)

Publication Number Publication Date
JPS50120272A true JPS50120272A (enrdf_load_stackoverflow) 1975-09-20

Family

ID=12160766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2525174A Pending JPS50120272A (enrdf_load_stackoverflow) 1974-03-06 1974-03-06

Country Status (1)

Country Link
JP (1) JPS50120272A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57148874U (enrdf_load_stackoverflow) * 1981-03-13 1982-09-18
JPS5827399A (ja) * 1981-07-29 1983-02-18 エヌ・ベー・フィリップス・フルーイランペンファブリケン 素子送給方法及び装置
JPS59132700U (ja) * 1983-02-25 1984-09-05 シ−ケ−デイ株式会社 チツプ部品の供給装置
JPS62133731A (ja) * 1985-12-05 1987-06-16 Mitsubishi Electric Corp 半導体ピツクアツプ装置
JP2014059925A (ja) * 2012-09-14 2014-04-03 Nhk Spring Co Ltd 圧電素子供給装置及び圧電素子の電気的特性測定方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57148874U (enrdf_load_stackoverflow) * 1981-03-13 1982-09-18
JPS5827399A (ja) * 1981-07-29 1983-02-18 エヌ・ベー・フィリップス・フルーイランペンファブリケン 素子送給方法及び装置
JPS59132700U (ja) * 1983-02-25 1984-09-05 シ−ケ−デイ株式会社 チツプ部品の供給装置
JPS62133731A (ja) * 1985-12-05 1987-06-16 Mitsubishi Electric Corp 半導体ピツクアツプ装置
JP2014059925A (ja) * 2012-09-14 2014-04-03 Nhk Spring Co Ltd 圧電素子供給装置及び圧電素子の電気的特性測定方法
US9638650B2 (en) 2012-09-14 2017-05-02 Nhk Spring Co., Ltd. Piezoelectric element feeder capable of measuring electric characteristics of piezoelectric element and method of measuring electric characteristics of piezoelectric element

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