JPS50114978A - - Google Patents
Info
- Publication number
- JPS50114978A JPS50114978A JP49018627A JP1862774A JPS50114978A JP S50114978 A JPS50114978 A JP S50114978A JP 49018627 A JP49018627 A JP 49018627A JP 1862774 A JP1862774 A JP 1862774A JP S50114978 A JPS50114978 A JP S50114978A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Bipolar Transistors (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49018627A JPS50114978A (enrdf_load_stackoverflow) | 1974-02-18 | 1974-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49018627A JPS50114978A (enrdf_load_stackoverflow) | 1974-02-18 | 1974-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50114978A true JPS50114978A (enrdf_load_stackoverflow) | 1975-09-09 |
Family
ID=11976844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49018627A Pending JPS50114978A (enrdf_load_stackoverflow) | 1974-02-18 | 1974-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50114978A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5558555A (en) * | 1978-10-25 | 1980-05-01 | Hitachi Ltd | Electronic device and its manufacture |
| JPS55130133A (en) * | 1979-03-30 | 1980-10-08 | Hitachi Ltd | Semiconductor device |
-
1974
- 1974-02-18 JP JP49018627A patent/JPS50114978A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5558555A (en) * | 1978-10-25 | 1980-05-01 | Hitachi Ltd | Electronic device and its manufacture |
| JPS55130133A (en) * | 1979-03-30 | 1980-10-08 | Hitachi Ltd | Semiconductor device |