JPS5011462U - - Google Patents
Info
- Publication number
- JPS5011462U JPS5011462U JP1973063162U JP6316273U JPS5011462U JP S5011462 U JPS5011462 U JP S5011462U JP 1973063162 U JP1973063162 U JP 1973063162U JP 6316273 U JP6316273 U JP 6316273U JP S5011462 U JPS5011462 U JP S5011462U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973063162U JPS5236535Y2 (https=) | 1973-05-29 | 1973-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973063162U JPS5236535Y2 (https=) | 1973-05-29 | 1973-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5011462U true JPS5011462U (https=) | 1975-02-05 |
| JPS5236535Y2 JPS5236535Y2 (https=) | 1977-08-19 |
Family
ID=28225289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973063162U Expired JPS5236535Y2 (https=) | 1973-05-29 | 1973-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5236535Y2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948841U (https=) * | 1972-08-02 | 1974-04-27 | ||
| JPS63145965U (https=) * | 1987-03-16 | 1988-09-27 |
-
1973
- 1973-05-29 JP JP1973063162U patent/JPS5236535Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948841U (https=) * | 1972-08-02 | 1974-04-27 | ||
| JPS63145965U (https=) * | 1987-03-16 | 1988-09-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5236535Y2 (https=) | 1977-08-19 |