JPS5011462U - - Google Patents
Info
- Publication number
- JPS5011462U JPS5011462U JP1973063162U JP6316273U JPS5011462U JP S5011462 U JPS5011462 U JP S5011462U JP 1973063162 U JP1973063162 U JP 1973063162U JP 6316273 U JP6316273 U JP 6316273U JP S5011462 U JPS5011462 U JP S5011462U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1973063162U JPS5236535Y2 (ja) | 1973-05-29 | 1973-05-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1973063162U JPS5236535Y2 (ja) | 1973-05-29 | 1973-05-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5011462U true JPS5011462U (ja) | 1975-02-05 |
JPS5236535Y2 JPS5236535Y2 (ja) | 1977-08-19 |
Family
ID=28225289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1973063162U Expired JPS5236535Y2 (ja) | 1973-05-29 | 1973-05-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5236535Y2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4948841U (ja) * | 1972-08-02 | 1974-04-27 | ||
JPS63145965U (ja) * | 1987-03-16 | 1988-09-27 |
-
1973
- 1973-05-29 JP JP1973063162U patent/JPS5236535Y2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4948841U (ja) * | 1972-08-02 | 1974-04-27 | ||
JPS63145965U (ja) * | 1987-03-16 | 1988-09-27 |
Also Published As
Publication number | Publication date |
---|---|
JPS5236535Y2 (ja) | 1977-08-19 |