JPS50114170A - - Google Patents
Info
- Publication number
- JPS50114170A JPS50114170A JP1823374A JP1823374A JPS50114170A JP S50114170 A JPS50114170 A JP S50114170A JP 1823374 A JP1823374 A JP 1823374A JP 1823374 A JP1823374 A JP 1823374A JP S50114170 A JPS50114170 A JP S50114170A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1823374A JPS50114170A (enrdf_load_stackoverflow) | 1974-02-15 | 1974-02-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1823374A JPS50114170A (enrdf_load_stackoverflow) | 1974-02-15 | 1974-02-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS50114170A true JPS50114170A (enrdf_load_stackoverflow) | 1975-09-06 |
Family
ID=11965939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1823374A Pending JPS50114170A (enrdf_load_stackoverflow) | 1974-02-15 | 1974-02-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS50114170A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56140630A (en) * | 1980-03-10 | 1981-11-04 | Trw Inc | Method of adhering passivation layer to gold region of semiconductor device |
JPS61137347A (ja) * | 1984-12-07 | 1986-06-25 | ゼネラル・エレクトリック・カンパニイ | 半導体チップの移動イオンを捕捉する端部シールの製造方法 |
JPH0284725A (ja) * | 1988-01-20 | 1990-03-26 | Nippon Mining Co Ltd | 半導体装置およびその製造方法 |
JPH0312950A (ja) * | 1989-06-12 | 1991-01-21 | Fujitsu Ltd | 絶縁物被膜の形成方法 |
JP2002016086A (ja) * | 2000-06-27 | 2002-01-18 | Fujitsu Ltd | 半導体装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS492440A (enrdf_load_stackoverflow) * | 1972-04-18 | 1974-01-10 |
-
1974
- 1974-02-15 JP JP1823374A patent/JPS50114170A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS492440A (enrdf_load_stackoverflow) * | 1972-04-18 | 1974-01-10 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56140630A (en) * | 1980-03-10 | 1981-11-04 | Trw Inc | Method of adhering passivation layer to gold region of semiconductor device |
JPS61137347A (ja) * | 1984-12-07 | 1986-06-25 | ゼネラル・エレクトリック・カンパニイ | 半導体チップの移動イオンを捕捉する端部シールの製造方法 |
JPH0284725A (ja) * | 1988-01-20 | 1990-03-26 | Nippon Mining Co Ltd | 半導体装置およびその製造方法 |
JPH0312950A (ja) * | 1989-06-12 | 1991-01-21 | Fujitsu Ltd | 絶縁物被膜の形成方法 |
JP2002016086A (ja) * | 2000-06-27 | 2002-01-18 | Fujitsu Ltd | 半導体装置 |