JPS5010967A - - Google Patents

Info

Publication number
JPS5010967A
JPS5010967A JP5866973A JP5866973A JPS5010967A JP S5010967 A JPS5010967 A JP S5010967A JP 5866973 A JP5866973 A JP 5866973A JP 5866973 A JP5866973 A JP 5866973A JP S5010967 A JPS5010967 A JP S5010967A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5866973A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5866973A priority Critical patent/JPS5010967A/ja
Publication of JPS5010967A publication Critical patent/JPS5010967A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)
JP5866973A 1973-05-28 1973-05-28 Pending JPS5010967A (index.php)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5866973A JPS5010967A (index.php) 1973-05-28 1973-05-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5866973A JPS5010967A (index.php) 1973-05-28 1973-05-28

Publications (1)

Publication Number Publication Date
JPS5010967A true JPS5010967A (index.php) 1975-02-04

Family

ID=13090981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5866973A Pending JPS5010967A (index.php) 1973-05-28 1973-05-28

Country Status (1)

Country Link
JP (1) JPS5010967A (index.php)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024263U (index.php) * 1988-06-20 1990-01-11
JPH03152966A (ja) * 1989-11-09 1991-06-28 Nec Corp 半導体装置用リードフレーム
JPH03252013A (ja) * 1990-02-28 1991-11-11 Matsushita Electric Ind Co Ltd 節度付エンコーダ
JPH03256353A (ja) * 1990-03-06 1991-11-15 Toshiba Corp 半導体装置
JPH048446U (index.php) * 1990-05-07 1992-01-27

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024263U (index.php) * 1988-06-20 1990-01-11
JPH03152966A (ja) * 1989-11-09 1991-06-28 Nec Corp 半導体装置用リードフレーム
JPH03252013A (ja) * 1990-02-28 1991-11-11 Matsushita Electric Ind Co Ltd 節度付エンコーダ
JPH03256353A (ja) * 1990-03-06 1991-11-15 Toshiba Corp 半導体装置
JPH048446U (index.php) * 1990-05-07 1992-01-27

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