JPS50109255A - - Google Patents
Info
- Publication number
- JPS50109255A JPS50109255A JP1456274A JP1456274A JPS50109255A JP S50109255 A JPS50109255 A JP S50109255A JP 1456274 A JP1456274 A JP 1456274A JP 1456274 A JP1456274 A JP 1456274A JP S50109255 A JPS50109255 A JP S50109255A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1456274A JPS50109255A (enrdf_load_stackoverflow) | 1974-02-06 | 1974-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1456274A JPS50109255A (enrdf_load_stackoverflow) | 1974-02-06 | 1974-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50109255A true JPS50109255A (enrdf_load_stackoverflow) | 1975-08-28 |
Family
ID=11864582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1456274A Pending JPS50109255A (enrdf_load_stackoverflow) | 1974-02-06 | 1974-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50109255A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5544766A (en) * | 1978-09-25 | 1980-03-29 | Nec Kyushu Ltd | Resin enclosing device |
| JPS5562744A (en) * | 1978-11-01 | 1980-05-12 | Nec Kyushu Ltd | Device for forming mold |
| JPS5926244U (ja) * | 1982-08-09 | 1984-02-18 | 坂東 一雄 | 半導体樹脂封入成形用の成形装置 |
| JPS59114038A (ja) * | 1982-12-21 | 1984-06-30 | Sumitomo Bakelite Co Ltd | トランスフア成形装置 |
| JPS61102041A (ja) * | 1984-10-25 | 1986-05-20 | Rohm Co Ltd | リ−ドフレ−ムのモ−ルド方法 |
| JPS6464816A (en) * | 1987-09-07 | 1989-03-10 | Kyushu Nippon Electric | Mold for resin sealing of semi-conductor apparatus |
-
1974
- 1974-02-06 JP JP1456274A patent/JPS50109255A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5544766A (en) * | 1978-09-25 | 1980-03-29 | Nec Kyushu Ltd | Resin enclosing device |
| JPS5562744A (en) * | 1978-11-01 | 1980-05-12 | Nec Kyushu Ltd | Device for forming mold |
| JPS5926244U (ja) * | 1982-08-09 | 1984-02-18 | 坂東 一雄 | 半導体樹脂封入成形用の成形装置 |
| JPS59114038A (ja) * | 1982-12-21 | 1984-06-30 | Sumitomo Bakelite Co Ltd | トランスフア成形装置 |
| JPS61102041A (ja) * | 1984-10-25 | 1986-05-20 | Rohm Co Ltd | リ−ドフレ−ムのモ−ルド方法 |
| JPS6464816A (en) * | 1987-09-07 | 1989-03-10 | Kyushu Nippon Electric | Mold for resin sealing of semi-conductor apparatus |