JPS50109254A - - Google Patents
Info
- Publication number
- JPS50109254A JPS50109254A JP1455474A JP1455474A JPS50109254A JP S50109254 A JPS50109254 A JP S50109254A JP 1455474 A JP1455474 A JP 1455474A JP 1455474 A JP1455474 A JP 1455474A JP S50109254 A JPS50109254 A JP S50109254A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1455474A JPS50109254A (ja) | 1974-02-06 | 1974-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1455474A JPS50109254A (ja) | 1974-02-06 | 1974-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50109254A true JPS50109254A (ja) | 1975-08-28 |
Family
ID=11864353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1455474A Pending JPS50109254A (ja) | 1974-02-06 | 1974-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50109254A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6244417A (ja) * | 1985-08-23 | 1987-02-26 | Toyoda Autom Loom Works Ltd | 射出成形機のスクリュ−推力制御方法 |
| JPH0794541A (ja) * | 1993-09-27 | 1995-04-07 | Toshiba Corp | 半導体樹脂封止装置 |
| JP2009101615A (ja) * | 2007-10-24 | 2009-05-14 | Apic Yamada Corp | トランスファ樹脂モールド方法およびトランスファモールド装置 |
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1974
- 1974-02-06 JP JP1455474A patent/JPS50109254A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6244417A (ja) * | 1985-08-23 | 1987-02-26 | Toyoda Autom Loom Works Ltd | 射出成形機のスクリュ−推力制御方法 |
| JPH0442972B2 (ja) * | 1985-08-23 | 1992-07-15 | Toyota Jido Shotsuki Seisakusho Kk | |
| JPH0794541A (ja) * | 1993-09-27 | 1995-04-07 | Toshiba Corp | 半導体樹脂封止装置 |
| JP2009101615A (ja) * | 2007-10-24 | 2009-05-14 | Apic Yamada Corp | トランスファ樹脂モールド方法およびトランスファモールド装置 |