JPS50108400A - - Google Patents

Info

Publication number
JPS50108400A
JPS50108400A JP1682574A JP1682574A JPS50108400A JP S50108400 A JPS50108400 A JP S50108400A JP 1682574 A JP1682574 A JP 1682574A JP 1682574 A JP1682574 A JP 1682574A JP S50108400 A JPS50108400 A JP S50108400A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1682574A
Other languages
Japanese (ja)
Other versions
JPS529480B2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49016825A priority Critical patent/JPS529480B2/ja
Publication of JPS50108400A publication Critical patent/JPS50108400A/ja
Publication of JPS529480B2 publication Critical patent/JPS529480B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP49016825A 1974-02-01 1974-02-01 Expired JPS529480B2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49016825A JPS529480B2 (enrdf_load_html_response) 1974-02-01 1974-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49016825A JPS529480B2 (enrdf_load_html_response) 1974-02-01 1974-02-01

Publications (2)

Publication Number Publication Date
JPS50108400A true JPS50108400A (enrdf_load_html_response) 1975-08-26
JPS529480B2 JPS529480B2 (enrdf_load_html_response) 1977-03-16

Family

ID=11926943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49016825A Expired JPS529480B2 (enrdf_load_html_response) 1974-02-01 1974-02-01

Country Status (1)

Country Link
JP (1) JPS529480B2 (enrdf_load_html_response)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555929A (en) * 1978-06-26 1980-01-17 Nitto Electric Ind Co Ltd Semiconductor sealing epoxy resin composition
JPS5598848A (en) * 1979-01-24 1980-07-28 Hitachi Ltd Resin-sealed type semiconductor device
DE3100536A1 (de) 1980-01-14 1981-12-17 Plaskon Products Inc., 43614 Toledo, Ohio Verfahren zur herstellung einer gratbildungsbestaendigen epoxyeinkapselungsmasse
JPS57109642A (en) * 1980-12-27 1982-07-08 Toshiba Chem Prod Copper plated laminated board
JPS63269555A (ja) * 1987-04-27 1988-11-07 Nitto Electric Ind Co Ltd 半導体装置
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200172A (en) * 1958-12-18 1965-08-10 Ciba Ltd Moulding compositions comprising epoxidized novolak, novolak and amine
US3280216A (en) * 1962-04-20 1966-10-18 Dow Chemical Co Self-extinguishing epoxy resin containing a halogenated polynuclear phenol and a hardening agent
US3519697A (en) * 1968-04-15 1970-07-07 Gen Electric Flame retardant epoxy resins

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200172A (en) * 1958-12-18 1965-08-10 Ciba Ltd Moulding compositions comprising epoxidized novolak, novolak and amine
US3280216A (en) * 1962-04-20 1966-10-18 Dow Chemical Co Self-extinguishing epoxy resin containing a halogenated polynuclear phenol and a hardening agent
US3519697A (en) * 1968-04-15 1970-07-07 Gen Electric Flame retardant epoxy resins

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555929A (en) * 1978-06-26 1980-01-17 Nitto Electric Ind Co Ltd Semiconductor sealing epoxy resin composition
JPS5598848A (en) * 1979-01-24 1980-07-28 Hitachi Ltd Resin-sealed type semiconductor device
DE3100536A1 (de) 1980-01-14 1981-12-17 Plaskon Products Inc., 43614 Toledo, Ohio Verfahren zur herstellung einer gratbildungsbestaendigen epoxyeinkapselungsmasse
DE3153142C2 (enrdf_load_html_response) * 1980-01-14 1991-11-14 Plaskon Products Inc., Toledo, Ohio, Us
JPS57109642A (en) * 1980-12-27 1982-07-08 Toshiba Chem Prod Copper plated laminated board
JPS63269555A (ja) * 1987-04-27 1988-11-07 Nitto Electric Ind Co Ltd 半導体装置
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device

Also Published As

Publication number Publication date
JPS529480B2 (enrdf_load_html_response) 1977-03-16

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