JPS50108400A - - Google Patents
Info
- Publication number
- JPS50108400A JPS50108400A JP1682574A JP1682574A JPS50108400A JP S50108400 A JPS50108400 A JP S50108400A JP 1682574 A JP1682574 A JP 1682574A JP 1682574 A JP1682574 A JP 1682574A JP S50108400 A JPS50108400 A JP S50108400A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49016825A JPS529480B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1974-02-01 | 1974-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49016825A JPS529480B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1974-02-01 | 1974-02-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50108400A true JPS50108400A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-08-26 |
| JPS529480B2 JPS529480B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1977-03-16 |
Family
ID=11926943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49016825A Expired JPS529480B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1974-02-01 | 1974-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS529480B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS555929A (en) * | 1978-06-26 | 1980-01-17 | Nitto Electric Ind Co Ltd | Semiconductor sealing epoxy resin composition |
| JPS5598848A (en) * | 1979-01-24 | 1980-07-28 | Hitachi Ltd | Resin-sealed type semiconductor device |
| DE3100536A1 (de) | 1980-01-14 | 1981-12-17 | Plaskon Products Inc., 43614 Toledo, Ohio | Verfahren zur herstellung einer gratbildungsbestaendigen epoxyeinkapselungsmasse |
| JPS57109642A (en) * | 1980-12-27 | 1982-07-08 | Toshiba Chem Prod | Copper plated laminated board |
| JPS63269555A (ja) * | 1987-04-27 | 1988-11-07 | Nitto Electric Ind Co Ltd | 半導体装置 |
| JPS6473748A (en) * | 1987-09-16 | 1989-03-20 | Nitto Denko Corp | Semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3200172A (en) * | 1958-12-18 | 1965-08-10 | Ciba Ltd | Moulding compositions comprising epoxidized novolak, novolak and amine |
| US3280216A (en) * | 1962-04-20 | 1966-10-18 | Dow Chemical Co | Self-extinguishing epoxy resin containing a halogenated polynuclear phenol and a hardening agent |
| US3519697A (en) * | 1968-04-15 | 1970-07-07 | Gen Electric | Flame retardant epoxy resins |
-
1974
- 1974-02-01 JP JP49016825A patent/JPS529480B2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3200172A (en) * | 1958-12-18 | 1965-08-10 | Ciba Ltd | Moulding compositions comprising epoxidized novolak, novolak and amine |
| US3280216A (en) * | 1962-04-20 | 1966-10-18 | Dow Chemical Co | Self-extinguishing epoxy resin containing a halogenated polynuclear phenol and a hardening agent |
| US3519697A (en) * | 1968-04-15 | 1970-07-07 | Gen Electric | Flame retardant epoxy resins |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS555929A (en) * | 1978-06-26 | 1980-01-17 | Nitto Electric Ind Co Ltd | Semiconductor sealing epoxy resin composition |
| JPS5598848A (en) * | 1979-01-24 | 1980-07-28 | Hitachi Ltd | Resin-sealed type semiconductor device |
| DE3100536A1 (de) | 1980-01-14 | 1981-12-17 | Plaskon Products Inc., 43614 Toledo, Ohio | Verfahren zur herstellung einer gratbildungsbestaendigen epoxyeinkapselungsmasse |
| DE3153142C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1980-01-14 | 1991-11-14 | Plaskon Products Inc., Toledo, Ohio, Us | |
| JPS57109642A (en) * | 1980-12-27 | 1982-07-08 | Toshiba Chem Prod | Copper plated laminated board |
| JPS63269555A (ja) * | 1987-04-27 | 1988-11-07 | Nitto Electric Ind Co Ltd | 半導体装置 |
| JPS6473748A (en) * | 1987-09-16 | 1989-03-20 | Nitto Denko Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS529480B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1977-03-16 |