JPS50104143A - - Google Patents
Info
- Publication number
- JPS50104143A JPS50104143A JP987674A JP987674A JPS50104143A JP S50104143 A JPS50104143 A JP S50104143A JP 987674 A JP987674 A JP 987674A JP 987674 A JP987674 A JP 987674A JP S50104143 A JPS50104143 A JP S50104143A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP987674A JPS50104143A (ja) | 1974-01-23 | 1974-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP987674A JPS50104143A (ja) | 1974-01-23 | 1974-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50104143A true JPS50104143A (ja) | 1975-08-16 |
Family
ID=11732342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP987674A Pending JPS50104143A (ja) | 1974-01-23 | 1974-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50104143A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03150392A (ja) * | 1989-09-05 | 1991-06-26 | General Electric Co <Ge> | 金属被覆ポリイミド複合物の調製方法 |
| WO2001053569A1 (en) * | 2000-01-20 | 2001-07-26 | Nikko Materials Company, Limited | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
| JP2004162172A (ja) * | 2002-11-14 | 2004-06-10 | Iljin Copper Foil Co Ltd | 電解銅箔製造用の電解液及びそれを用いた電解銅箔の製造方法 |
| WO2006129886A1 (en) * | 2005-06-03 | 2006-12-07 | Fujifilm Corporation | Plating method, electrically conductive film and light-transmitting electromagnetic wave shielding film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2039831A1 (de) * | 1970-06-06 | 1972-01-05 | Schering Ag | Saurer Elektrolyt zur Abscheidung glaenzender Kupferueberzuege |
-
1974
- 1974-01-23 JP JP987674A patent/JPS50104143A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2039831A1 (de) * | 1970-06-06 | 1972-01-05 | Schering Ag | Saurer Elektrolyt zur Abscheidung glaenzender Kupferueberzuege |
| US3743584A (en) * | 1970-06-06 | 1973-07-03 | Schering Ag | Acid bright copper plating bath |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03150392A (ja) * | 1989-09-05 | 1991-06-26 | General Electric Co <Ge> | 金属被覆ポリイミド複合物の調製方法 |
| WO2001053569A1 (en) * | 2000-01-20 | 2001-07-26 | Nikko Materials Company, Limited | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
| JP2004162172A (ja) * | 2002-11-14 | 2004-06-10 | Iljin Copper Foil Co Ltd | 電解銅箔製造用の電解液及びそれを用いた電解銅箔の製造方法 |
| WO2006129886A1 (en) * | 2005-06-03 | 2006-12-07 | Fujifilm Corporation | Plating method, electrically conductive film and light-transmitting electromagnetic wave shielding film |