JPS4994786A - - Google Patents
Info
- Publication number
- JPS4994786A JPS4994786A JP47117184A JP11718472A JPS4994786A JP S4994786 A JPS4994786 A JP S4994786A JP 47117184 A JP47117184 A JP 47117184A JP 11718472 A JP11718472 A JP 11718472A JP S4994786 A JPS4994786 A JP S4994786A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47117184A JPS4994786A (ko) | 1972-11-24 | 1972-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47117184A JPS4994786A (ko) | 1972-11-24 | 1972-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4994786A true JPS4994786A (ko) | 1974-09-09 |
Family
ID=14705481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47117184A Pending JPS4994786A (ko) | 1972-11-24 | 1972-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4994786A (ko) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01205513A (ja) * | 1988-02-12 | 1989-08-17 | Nissin Electric Co Ltd | 乾式コンデンサ |
| US5118729A (en) * | 1990-01-10 | 1992-06-02 | The Dow Chemical Company | Modified polyoxyethylene epoxy resin amphiphiles and stable aqueous epoxy dispersions thereof |
| EP0491550A2 (en) * | 1990-12-17 | 1992-06-24 | The Dow Chemical Company | Water-emulsifiable epoxy resin composition |
| EP0738759A4 (en) * | 1994-11-09 | 1998-09-09 | Nitto Denko Corp | EPOXIDE RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICES |
| JP2003062934A (ja) * | 2002-03-29 | 2003-03-05 | Dainippon Printing Co Ltd | 厚膜パターン形成方法 |
-
1972
- 1972-11-24 JP JP47117184A patent/JPS4994786A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01205513A (ja) * | 1988-02-12 | 1989-08-17 | Nissin Electric Co Ltd | 乾式コンデンサ |
| US5118729A (en) * | 1990-01-10 | 1992-06-02 | The Dow Chemical Company | Modified polyoxyethylene epoxy resin amphiphiles and stable aqueous epoxy dispersions thereof |
| EP0510117A1 (en) * | 1990-01-10 | 1992-10-28 | The Dow Chemical Company | Modified polyoxyethylene epoxy resin amphiphiles and stable aqueous epoxy dispersions thereof |
| EP0491550A2 (en) * | 1990-12-17 | 1992-06-24 | The Dow Chemical Company | Water-emulsifiable epoxy resin composition |
| EP0738759A4 (en) * | 1994-11-09 | 1998-09-09 | Nitto Denko Corp | EPOXIDE RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICES |
| JP2003062934A (ja) * | 2002-03-29 | 2003-03-05 | Dainippon Printing Co Ltd | 厚膜パターン形成方法 |