JPS4993870A - - Google Patents
Info
- Publication number
- JPS4993870A JPS4993870A JP48116002A JP11600273A JPS4993870A JP S4993870 A JPS4993870 A JP S4993870A JP 48116002 A JP48116002 A JP 48116002A JP 11600273 A JP11600273 A JP 11600273A JP S4993870 A JPS4993870 A JP S4993870A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/298,213 US3931454A (en) | 1972-10-17 | 1972-10-17 | Printed circuit board and method of preparing it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4993870A true JPS4993870A (US06368395-20020409-C00050.png) | 1974-09-06 |
Family
ID=23149523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48116002A Pending JPS4993870A (US06368395-20020409-C00050.png) | 1972-10-17 | 1973-10-17 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3931454A (US06368395-20020409-C00050.png) |
| JP (1) | JPS4993870A (US06368395-20020409-C00050.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5262870U (US06368395-20020409-C00050.png) * | 1975-11-06 | 1977-05-10 | ||
| JP2012500487A (ja) * | 2008-08-18 | 2012-01-05 | センブラント グローバル リミテッド | ハロ炭化水素ポリマーコーティング |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4238528A (en) * | 1978-06-26 | 1980-12-09 | International Business Machines Corporation | Polyimide coating process and material |
| JPS6040705B2 (ja) * | 1978-06-26 | 1985-09-12 | インタ−ナシヨナル・ビジネス・マシ−ンンズ・コ−ポレ−シヨン | 電子回路の保護被覆形成方法 |
| JPS61189693A (ja) * | 1985-02-19 | 1986-08-23 | 旭硝子株式会社 | 電子部品の防湿コ−テイング方法 |
| IT1215557B (it) * | 1987-06-11 | 1990-02-14 | Montedison Spa | Quali componenti di vernici poliisocianati fluorurati idonei |
| US20040028914A1 (en) * | 2000-11-16 | 2004-02-12 | Hideto Yanome | Water-repellent, oil-repellent and soil resistant coating composition |
| US6586683B2 (en) * | 2001-04-27 | 2003-07-01 | International Business Machines Corporation | Printed circuit board with mixed metallurgy pads and method of fabrication |
| US7175876B2 (en) | 2003-06-27 | 2007-02-13 | 3M Innovative Properties Company | Patterned coating method employing polymeric coatings |
| EP2078063B1 (en) * | 2006-10-24 | 2010-03-17 | Akzo Nobel Coatings International B.V. | Non-stick coating composition |
| GB0703172D0 (en) * | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
| US8618420B2 (en) * | 2008-08-18 | 2013-12-31 | Semblant Global Limited | Apparatus with a wire bond and method of forming the same |
| WO2011046770A1 (en) * | 2009-10-14 | 2011-04-21 | Lockheed Martin Corporation | Serviceable conformal em shield |
| US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
| US8824162B2 (en) * | 2010-08-30 | 2014-09-02 | Apple Inc. | Electronic devices with moisture guiding structures |
| US8947889B2 (en) | 2010-10-14 | 2015-02-03 | Lockheed Martin Corporation | Conformal electromagnetic (EM) detector |
| GB2485419B (en) * | 2010-11-15 | 2015-02-25 | Semblant Ltd | Method for reducing creep corrosion |
| US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
| US11495560B2 (en) * | 2015-08-10 | 2022-11-08 | X Display Company Technology Limited | Chiplets with connection posts |
| GB201621177D0 (en) | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
| US10287131B2 (en) | 2017-06-05 | 2019-05-14 | Otis Elevator Company | Elevator drive control to protect drive components from moisture |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2877544A (en) * | 1954-08-30 | 1959-03-17 | Western Electric Co | Method of locating and replacing defective components of encapsulated electrical assemblies |
| US3377699A (en) * | 1965-05-03 | 1968-04-16 | Western Electric Co | Fluidized bed coating a core containing metal board, including circuit forming, core wiring and connecting steps |
| GB1257071A (US06368395-20020409-C00050.png) * | 1969-01-22 | 1971-12-15 | ||
| US3693252A (en) * | 1969-08-21 | 1972-09-26 | Globe Union Inc | A method of providing environmental protection for electrical circuit assemblies |
| US3652333A (en) * | 1970-02-02 | 1972-03-28 | Gen Dynamics Corp | Encapsulating composition for electronic circuit boards and process for applying same |
-
1972
- 1972-10-17 US US05/298,213 patent/US3931454A/en not_active Expired - Lifetime
-
1973
- 1973-10-17 JP JP48116002A patent/JPS4993870A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5262870U (US06368395-20020409-C00050.png) * | 1975-11-06 | 1977-05-10 | ||
| JP2012500487A (ja) * | 2008-08-18 | 2012-01-05 | センブラント グローバル リミテッド | ハロ炭化水素ポリマーコーティング |
Also Published As
| Publication number | Publication date |
|---|---|
| US3931454A (en) | 1976-01-06 |
