JPS499188A - - Google Patents

Info

Publication number
JPS499188A
JPS499188A JP47046630A JP4663072A JPS499188A JP S499188 A JPS499188 A JP S499188A JP 47046630 A JP47046630 A JP 47046630A JP 4663072 A JP4663072 A JP 4663072A JP S499188 A JPS499188 A JP S499188A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47046630A
Other languages
Japanese (ja)
Other versions
JPS5329269B2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4663072A priority Critical patent/JPS5329269B2/ja
Publication of JPS499188A publication Critical patent/JPS499188A/ja
Publication of JPS5329269B2 publication Critical patent/JPS5329269B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP4663072A 1972-05-11 1972-05-11 Expired JPS5329269B2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4663072A JPS5329269B2 (en:Method) 1972-05-11 1972-05-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4663072A JPS5329269B2 (en:Method) 1972-05-11 1972-05-11

Publications (2)

Publication Number Publication Date
JPS499188A true JPS499188A (en:Method) 1974-01-26
JPS5329269B2 JPS5329269B2 (en:Method) 1978-08-19

Family

ID=12752601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4663072A Expired JPS5329269B2 (en:Method) 1972-05-11 1972-05-11

Country Status (1)

Country Link
JP (1) JPS5329269B2 (en:Method)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53115872U (en:Method) * 1977-02-21 1978-09-14
JPS54116780A (en) * 1978-03-02 1979-09-11 Shinko Electric Co Ltd Electrostatic separating device
JPS572172U (en:Method) * 1980-06-05 1982-01-07
JPS63298809A (ja) * 1987-05-29 1988-12-06 Toshiba Corp 磁気ヘッド装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53115872U (en:Method) * 1977-02-21 1978-09-14
JPS54116780A (en) * 1978-03-02 1979-09-11 Shinko Electric Co Ltd Electrostatic separating device
JPS572172U (en:Method) * 1980-06-05 1982-01-07
JPS63298809A (ja) * 1987-05-29 1988-12-06 Toshiba Corp 磁気ヘッド装置

Also Published As

Publication number Publication date
JPS5329269B2 (en:Method) 1978-08-19

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