JPS4990879A - - Google Patents

Info

Publication number
JPS4990879A
JPS4990879A JP336573A JP336573A JPS4990879A JP S4990879 A JPS4990879 A JP S4990879A JP 336573 A JP336573 A JP 336573A JP 336573 A JP336573 A JP 336573A JP S4990879 A JPS4990879 A JP S4990879A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP336573A
Other languages
Japanese (ja)
Other versions
JPS5422069B2 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP336573A priority Critical patent/JPS5422069B2/ja
Publication of JPS4990879A publication Critical patent/JPS4990879A/ja
Publication of JPS5422069B2 publication Critical patent/JPS5422069B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
JP336573A 1972-12-28 1972-12-28 Expired JPS5422069B2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP336573A JPS5422069B2 (fr) 1972-12-28 1972-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP336573A JPS5422069B2 (fr) 1972-12-28 1972-12-28

Publications (2)

Publication Number Publication Date
JPS4990879A true JPS4990879A (fr) 1974-08-30
JPS5422069B2 JPS5422069B2 (fr) 1979-08-03

Family

ID=11555305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP336573A Expired JPS5422069B2 (fr) 1972-12-28 1972-12-28

Country Status (1)

Country Link
JP (1) JPS5422069B2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53128981A (en) * 1977-04-15 1978-11-10 Nec Corp Manufacture of semiconductor device
JPS559487A (en) * 1978-07-07 1980-01-23 Matsushita Electric Ind Co Ltd Method of making semiconductor device
JPS559488A (en) * 1978-07-07 1980-01-23 Matsushita Electric Ind Co Ltd Method of making semiconductor device
JPH02251150A (ja) * 1989-03-24 1990-10-08 Mitsubishi Metal Corp 半導体装置組立用Ａｕ―Ｓｉ系合金

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59132818A (ja) * 1983-01-14 1984-07-31 井関農機株式会社 脱穀機の選別装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53128981A (en) * 1977-04-15 1978-11-10 Nec Corp Manufacture of semiconductor device
JPS6142856B2 (fr) * 1977-04-15 1986-09-24 Nippon Electric Co
JPS559487A (en) * 1978-07-07 1980-01-23 Matsushita Electric Ind Co Ltd Method of making semiconductor device
JPS559488A (en) * 1978-07-07 1980-01-23 Matsushita Electric Ind Co Ltd Method of making semiconductor device
JPH02251150A (ja) * 1989-03-24 1990-10-08 Mitsubishi Metal Corp 半導体装置組立用Ａｕ―Ｓｉ系合金

Also Published As

Publication number Publication date
JPS5422069B2 (fr) 1979-08-03

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