JPS4981866A - - Google Patents
Info
- Publication number
- JPS4981866A JPS4981866A JP12494372A JP12494372A JPS4981866A JP S4981866 A JPS4981866 A JP S4981866A JP 12494372 A JP12494372 A JP 12494372A JP 12494372 A JP12494372 A JP 12494372A JP S4981866 A JPS4981866 A JP S4981866A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12494372A JPS5510999B2 (fr) | 1972-12-13 | 1972-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12494372A JPS5510999B2 (fr) | 1972-12-13 | 1972-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4981866A true JPS4981866A (fr) | 1974-08-07 |
| JPS5510999B2 JPS5510999B2 (fr) | 1980-03-21 |
Family
ID=14898020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12494372A Expired JPS5510999B2 (fr) | 1972-12-13 | 1972-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5510999B2 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55102257A (en) * | 1979-01-30 | 1980-08-05 | Hitachi Chem Co Ltd | Method for forming package of semiconductor and the like |
| JPS55110061A (en) * | 1979-02-17 | 1980-08-25 | Hitachi Chem Co Ltd | Fabrication of semiconductor package |
| JP2020113611A (ja) * | 2019-01-10 | 2020-07-27 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
-
1972
- 1972-12-13 JP JP12494372A patent/JPS5510999B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55102257A (en) * | 1979-01-30 | 1980-08-05 | Hitachi Chem Co Ltd | Method for forming package of semiconductor and the like |
| JPS55110061A (en) * | 1979-02-17 | 1980-08-25 | Hitachi Chem Co Ltd | Fabrication of semiconductor package |
| JPS58185B2 (ja) * | 1979-02-17 | 1983-01-05 | 日立化成工業株式会社 | 半導体類のパッケ−ジ成形方法 |
| JP2020113611A (ja) * | 2019-01-10 | 2020-07-27 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5510999B2 (fr) | 1980-03-21 |