JPS4979190A - - Google Patents
Info
- Publication number
- JPS4979190A JPS4979190A JP12061572A JP12061572A JPS4979190A JP S4979190 A JPS4979190 A JP S4979190A JP 12061572 A JP12061572 A JP 12061572A JP 12061572 A JP12061572 A JP 12061572A JP S4979190 A JPS4979190 A JP S4979190A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
- Electrodes Of Semiconductors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12061572A JPS4979190A (ja) | 1972-12-04 | 1972-12-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12061572A JPS4979190A (ja) | 1972-12-04 | 1972-12-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4979190A true JPS4979190A (ja) | 1974-07-31 |
Family
ID=14790614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12061572A Pending JPS4979190A (ja) | 1972-12-04 | 1972-12-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4979190A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6165457A (ja) * | 1984-09-07 | 1986-04-04 | Hitachi Ltd | 半導体装置の多層配線構造 |
JPS62268144A (ja) * | 1986-05-16 | 1987-11-20 | Hitachi Ltd | 多層配線構造体 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619733A (en) * | 1969-08-18 | 1971-11-09 | Rca Corp | Semiconductor device with multilevel metalization and method of making the same |
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1972
- 1972-12-04 JP JP12061572A patent/JPS4979190A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619733A (en) * | 1969-08-18 | 1971-11-09 | Rca Corp | Semiconductor device with multilevel metalization and method of making the same |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6165457A (ja) * | 1984-09-07 | 1986-04-04 | Hitachi Ltd | 半導体装置の多層配線構造 |
JPH0330991B2 (ja) * | 1984-09-07 | 1991-05-01 | Hitachi Seisakusho Kk | |
JPS62268144A (ja) * | 1986-05-16 | 1987-11-20 | Hitachi Ltd | 多層配線構造体 |