JPS4979190A - - Google Patents

Info

Publication number
JPS4979190A
JPS4979190A JP12061572A JP12061572A JPS4979190A JP S4979190 A JPS4979190 A JP S4979190A JP 12061572 A JP12061572 A JP 12061572A JP 12061572 A JP12061572 A JP 12061572A JP S4979190 A JPS4979190 A JP S4979190A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12061572A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12061572A priority Critical patent/JPS4979190A/ja
Publication of JPS4979190A publication Critical patent/JPS4979190A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP12061572A 1972-12-04 1972-12-04 Pending JPS4979190A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12061572A JPS4979190A (ja) 1972-12-04 1972-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12061572A JPS4979190A (ja) 1972-12-04 1972-12-04

Publications (1)

Publication Number Publication Date
JPS4979190A true JPS4979190A (ja) 1974-07-31

Family

ID=14790614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12061572A Pending JPS4979190A (ja) 1972-12-04 1972-12-04

Country Status (1)

Country Link
JP (1) JPS4979190A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6165457A (ja) * 1984-09-07 1986-04-04 Hitachi Ltd 半導体装置の多層配線構造
JPS62268144A (ja) * 1986-05-16 1987-11-20 Hitachi Ltd 多層配線構造体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6165457A (ja) * 1984-09-07 1986-04-04 Hitachi Ltd 半導体装置の多層配線構造
JPH0330991B2 (ja) * 1984-09-07 1991-05-01 Hitachi Seisakusho Kk
JPS62268144A (ja) * 1986-05-16 1987-11-20 Hitachi Ltd 多層配線構造体

Similar Documents

Publication Publication Date Title
FR2184868A1 (ja)
IN139010B (ja)
JPS4979190A (ja)
JPS4983626A (ja)
JPS519922Y2 (ja)
FR2180173A5 (ja)
JPS4923254A (ja)
JPS4972758U (ja)
JPS5315535Y2 (ja)
JPS5318126Y2 (ja)
JPS5227661B2 (ja)
JPS4954199A (ja)
JPS4952798U (ja)
JPS4951840A (ja)
CS153303B1 (ja)
JPS4875165A (ja)
CS152036B1 (ja)
CS153851B1 (ja)
CH590078A5 (ja)
CH583721A5 (ja)
CH602572A5 (ja)
CH594605A5 (ja)
CH592094A5 (ja)
CH591491A5 (ja)
CH565453A5 (ja)