JPS4963850U - - Google Patents

Info

Publication number
JPS4963850U
JPS4963850U JP10762572U JP10762572U JPS4963850U JP S4963850 U JPS4963850 U JP S4963850U JP 10762572 U JP10762572 U JP 10762572U JP 10762572 U JP10762572 U JP 10762572U JP S4963850 U JPS4963850 U JP S4963850U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10762572U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10762572U priority Critical patent/JPS4963850U/ja
Publication of JPS4963850U publication Critical patent/JPS4963850U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10762572U 1972-09-18 1972-09-18 Pending JPS4963850U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10762572U JPS4963850U (de) 1972-09-18 1972-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10762572U JPS4963850U (de) 1972-09-18 1972-09-18

Publications (1)

Publication Number Publication Date
JPS4963850U true JPS4963850U (de) 1974-06-04

Family

ID=28325783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10762572U Pending JPS4963850U (de) 1972-09-18 1972-09-18

Country Status (1)

Country Link
JP (1) JPS4963850U (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58195434U (ja) * 1982-06-22 1983-12-26 三菱電機株式会社 半導体樹脂封止装置の金型

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58195434U (ja) * 1982-06-22 1983-12-26 三菱電機株式会社 半導体樹脂封止装置の金型

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