JPS4962084A - - Google Patents
Info
- Publication number
- JPS4962084A JPS4962084A JP48049640A JP4964073A JPS4962084A JP S4962084 A JPS4962084 A JP S4962084A JP 48049640 A JP48049640 A JP 48049640A JP 4964073 A JP4964073 A JP 4964073A JP S4962084 A JPS4962084 A JP S4962084A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10P72/0441—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
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- H10W70/421—
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- H10W76/134—
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- H10W95/00—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H10W70/682—
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- H10W70/685—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2068872A GB1426874A (en) | 1972-05-03 | 1972-05-03 | Method of sealing electrical component envelopes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4962084A true JPS4962084A (OSRAM) | 1974-06-15 |
Family
ID=10150028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48049640A Pending JPS4962084A (OSRAM) | 1972-05-03 | 1973-05-02 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3896542A (OSRAM) |
| JP (1) | JPS4962084A (OSRAM) |
| DE (1) | DE2318736A1 (OSRAM) |
| FR (1) | FR2183214A1 (OSRAM) |
| GB (1) | GB1426874A (OSRAM) |
| IT (1) | IT980933B (OSRAM) |
| NL (1) | NL7305889A (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60156757U (ja) * | 1984-03-28 | 1985-10-18 | 株式会社 フジ電科 | 気密端子 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4262300A (en) * | 1978-11-03 | 1981-04-14 | Isotronics, Inc. | Microcircuit package formed of multi-components |
| US4291815B1 (en) * | 1980-02-19 | 1998-09-29 | Semiconductor Packaging Materi | Ceramic lid assembly for hermetic sealing of a semiconductor chip |
| JPS57170581A (en) * | 1981-03-26 | 1982-10-20 | Sperry Rand Ltd | Seal and method of forming same |
| DE3242283A1 (de) * | 1982-11-16 | 1984-05-17 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zur herstellung eines ein- oder mehrduesigen tintenstrahldruckers |
| US4640438A (en) * | 1986-03-17 | 1987-02-03 | Comienco Limited | Cover for semiconductor device packages |
| US4919291A (en) * | 1987-11-23 | 1990-04-24 | Santa Barbara Research Center | Metallurgically improved tip-off tube for a vacuum enclosure |
| NL8800901A (nl) * | 1988-04-08 | 1989-11-01 | Philips Nv | Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie. |
| NL8800902A (nl) * | 1988-04-08 | 1989-11-01 | Philips Nv | Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager. |
| US5168425A (en) * | 1991-10-16 | 1992-12-01 | General Electric Company | Mounting arrangements for high voltage/high power semiconductors |
| DE102019135171A1 (de) * | 2019-12-19 | 2021-06-24 | Rogers Germany Gmbh | Lotmaterial, Verfahren zur Herstellung eines solchen Lotmaterials und Verwendung eines solchen Lotmaterials zur Anbindung einer Metallschicht an eine Keramikschicht |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2671746A (en) * | 1950-06-17 | 1954-03-09 | Richard D Brew & Company Inc | Bonding system |
| US2965962A (en) * | 1954-12-07 | 1960-12-27 | Rca Corp | Hermetic seal and method of making the same |
| US3203083A (en) * | 1961-02-08 | 1965-08-31 | Texas Instruments Inc | Method of manufacturing a hermetically sealed semiconductor capsule |
| US3383454A (en) * | 1964-01-10 | 1968-05-14 | Gti Corp | Micromodular package |
| US3340602A (en) * | 1965-02-01 | 1967-09-12 | Philco Ford Corp | Process for sealing |
| US3478416A (en) * | 1967-02-15 | 1969-11-18 | North American Rockwell | Bonding of beryllium members |
| US3543383A (en) * | 1967-02-20 | 1970-12-01 | Gen Electrodynamics Corp | Indium seal |
| GB1198257A (en) * | 1967-04-29 | 1970-07-08 | Int Computers Ltd | Improvements in Methods of Bonding Electrical Conductors |
| US3772764A (en) * | 1970-08-03 | 1973-11-20 | Gen Motors Corp | Method of making enclosure for a semiconductor device |
| US3711939A (en) * | 1970-11-10 | 1973-01-23 | M Stoll | Method and apparatus for sealing |
-
1972
- 1972-05-03 GB GB2068872A patent/GB1426874A/en not_active Expired
-
1973
- 1973-04-13 DE DE2318736A patent/DE2318736A1/de active Pending
- 1973-04-20 US US352872A patent/US3896542A/en not_active Expired - Lifetime
- 1973-04-27 NL NL7305889A patent/NL7305889A/xx unknown
- 1973-04-30 IT IT68203/73A patent/IT980933B/it active
- 1973-05-02 JP JP48049640A patent/JPS4962084A/ja active Pending
- 1973-05-03 FR FR7315884A patent/FR2183214A1/fr not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60156757U (ja) * | 1984-03-28 | 1985-10-18 | 株式会社 フジ電科 | 気密端子 |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7305889A (OSRAM) | 1973-11-06 |
| US3896542A (en) | 1975-07-29 |
| GB1426874A (en) | 1976-03-03 |
| IT980933B (it) | 1974-10-10 |
| DE2318736A1 (de) | 1973-11-15 |
| FR2183214A1 (OSRAM) | 1973-12-14 |