JPS4958750A - - Google Patents
Info
- Publication number
- JPS4958750A JPS4958750A JP47099052A JP9905272A JPS4958750A JP S4958750 A JPS4958750 A JP S4958750A JP 47099052 A JP47099052 A JP 47099052A JP 9905272 A JP9905272 A JP 9905272A JP S4958750 A JPS4958750 A JP S4958750A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47099052A JPS4958750A (en, 2012) | 1972-10-04 | 1972-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47099052A JPS4958750A (en, 2012) | 1972-10-04 | 1972-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4958750A true JPS4958750A (en, 2012) | 1974-06-07 |
Family
ID=14236808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47099052A Pending JPS4958750A (en, 2012) | 1972-10-04 | 1972-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4958750A (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155494A (en) * | 1976-06-21 | 1977-12-23 | Nippon Telegr & Teleph Corp <Ntt> | Process for w orking parallel plane of wafer |
| JPS531464A (en) * | 1976-06-28 | 1978-01-09 | Nippon Telegr & Teleph Corp <Ntt> | Bonding for crystal base |
| JPS5537198U (en, 2012) * | 1979-09-05 | 1980-03-10 |
-
1972
- 1972-10-04 JP JP47099052A patent/JPS4958750A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155494A (en) * | 1976-06-21 | 1977-12-23 | Nippon Telegr & Teleph Corp <Ntt> | Process for w orking parallel plane of wafer |
| JPS531464A (en) * | 1976-06-28 | 1978-01-09 | Nippon Telegr & Teleph Corp <Ntt> | Bonding for crystal base |
| JPS5537198U (en, 2012) * | 1979-09-05 | 1980-03-10 |