JPS4957845A - - Google Patents
Info
- Publication number
- JPS4957845A JPS4957845A JP47097700A JP9770072A JPS4957845A JP S4957845 A JPS4957845 A JP S4957845A JP 47097700 A JP47097700 A JP 47097700A JP 9770072 A JP9770072 A JP 9770072A JP S4957845 A JPS4957845 A JP S4957845A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Holo Graphy (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47097700A JPS4957845A (Direct) | 1972-09-30 | 1972-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47097700A JPS4957845A (Direct) | 1972-09-30 | 1972-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4957845A true JPS4957845A (Direct) | 1974-06-05 |
Family
ID=14199192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47097700A Pending JPS4957845A (Direct) | 1972-09-30 | 1972-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4957845A (Direct) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745933A (en) * | 1980-09-02 | 1982-03-16 | Nec Corp | Heat treating method and device for semiconductor wafer |
| JPS58154233A (ja) * | 1982-03-10 | 1983-09-13 | Agency Of Ind Science & Technol | 半導体材料の周期的エツチング方法 |
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1972
- 1972-09-30 JP JP47097700A patent/JPS4957845A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745933A (en) * | 1980-09-02 | 1982-03-16 | Nec Corp | Heat treating method and device for semiconductor wafer |
| JPS58154233A (ja) * | 1982-03-10 | 1983-09-13 | Agency Of Ind Science & Technol | 半導体材料の周期的エツチング方法 |