JPS495576A - - Google Patents
Info
- Publication number
- JPS495576A JPS495576A JP47044121A JP4412172A JPS495576A JP S495576 A JPS495576 A JP S495576A JP 47044121 A JP47044121 A JP 47044121A JP 4412172 A JP4412172 A JP 4412172A JP S495576 A JPS495576 A JP S495576A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
- H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
- H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
- H01L2224/02165—Reinforcing structures
- H01L2224/02166—Collar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47044121A JPS5132508B2 (en, 2012) | 1972-05-02 | 1972-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47044121A JPS5132508B2 (en, 2012) | 1972-05-02 | 1972-05-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS495576A true JPS495576A (en, 2012) | 1974-01-18 |
| JPS5132508B2 JPS5132508B2 (en, 2012) | 1976-09-13 |
Family
ID=12682757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47044121A Expired JPS5132508B2 (en, 2012) | 1972-05-02 | 1972-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5132508B2 (en, 2012) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49131349A (en, 2012) * | 1973-04-18 | 1974-12-17 | ||
| JPS5065136A (en, 2012) * | 1973-10-11 | 1975-06-02 | ||
| JPS55166240A (en) * | 1979-06-12 | 1980-12-25 | Sekisui Chemical Co Ltd | Compound pipe and and its preparation |
| JPH04311044A (ja) * | 1991-04-09 | 1992-11-02 | Matsushita Electric Ind Co Ltd | ワイヤボンディング装置およびワイヤボンディング方法 |
| JPH09129581A (ja) * | 1996-09-27 | 1997-05-16 | Matsushita Electric Ind Co Ltd | 基板のプラズマクリーニング装置 |
-
1972
- 1972-05-02 JP JP47044121A patent/JPS5132508B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49131349A (en, 2012) * | 1973-04-18 | 1974-12-17 | ||
| JPS5065136A (en, 2012) * | 1973-10-11 | 1975-06-02 | ||
| JPS55166240A (en) * | 1979-06-12 | 1980-12-25 | Sekisui Chemical Co Ltd | Compound pipe and and its preparation |
| JPH04311044A (ja) * | 1991-04-09 | 1992-11-02 | Matsushita Electric Ind Co Ltd | ワイヤボンディング装置およびワイヤボンディング方法 |
| JPH09129581A (ja) * | 1996-09-27 | 1997-05-16 | Matsushita Electric Ind Co Ltd | 基板のプラズマクリーニング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5132508B2 (en, 2012) | 1976-09-13 |