JPS4955279A - - Google Patents
Info
- Publication number
- JPS4955279A JPS4955279A JP47096429A JP9642972A JPS4955279A JP S4955279 A JPS4955279 A JP S4955279A JP 47096429 A JP47096429 A JP 47096429A JP 9642972 A JP9642972 A JP 9642972A JP S4955279 A JPS4955279 A JP S4955279A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47096429A JPS5232063B2 (en:Method) | 1972-09-25 | 1972-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47096429A JPS5232063B2 (en:Method) | 1972-09-25 | 1972-09-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4955279A true JPS4955279A (en:Method) | 1974-05-29 |
| JPS5232063B2 JPS5232063B2 (en:Method) | 1977-08-19 |
Family
ID=14164737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47096429A Expired JPS5232063B2 (en:Method) | 1972-09-25 | 1972-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5232063B2 (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0260324U (en:Method) * | 1988-10-26 | 1990-05-02 | ||
| JP2014072522A (ja) * | 2012-09-27 | 2014-04-21 | Samsung Electro-Mechanics Co Ltd | チップ素子及びその製造方法 |
| JP2015208868A (ja) * | 2014-04-24 | 2015-11-24 | アピックヤマダ株式会社 | 樹脂モールド装置及び樹脂モールド方法並びにモールド成形品 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0359804U (en:Method) * | 1989-10-17 | 1991-06-12 |
-
1972
- 1972-09-25 JP JP47096429A patent/JPS5232063B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0260324U (en:Method) * | 1988-10-26 | 1990-05-02 | ||
| JP2014072522A (ja) * | 2012-09-27 | 2014-04-21 | Samsung Electro-Mechanics Co Ltd | チップ素子及びその製造方法 |
| JP2015208868A (ja) * | 2014-04-24 | 2015-11-24 | アピックヤマダ株式会社 | 樹脂モールド装置及び樹脂モールド方法並びにモールド成形品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5232063B2 (en:Method) | 1977-08-19 |