JPS4952799A - - Google Patents
Info
- Publication number
- JPS4952799A JPS4952799A JP9559272A JP9559272A JPS4952799A JP S4952799 A JPS4952799 A JP S4952799A JP 9559272 A JP9559272 A JP 9559272A JP 9559272 A JP9559272 A JP 9559272A JP S4952799 A JPS4952799 A JP S4952799A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Silicon Compounds (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9559272A JPS4952799A (cs) | 1972-09-22 | 1972-09-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9559272A JPS4952799A (cs) | 1972-09-22 | 1972-09-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4952799A true JPS4952799A (cs) | 1974-05-22 |
Family
ID=14141834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9559272A Pending JPS4952799A (cs) | 1972-09-22 | 1972-09-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4952799A (cs) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6162739A (en) * | 1998-02-11 | 2000-12-19 | Sez Semiconductor-Equipment Zubehor Fur Die Halbleiterfertigung Ag | Process for wet etching of semiconductor wafers |
US7052627B1 (en) | 1998-11-24 | 2006-05-30 | Daikin Industries, Ltd. | Etching solution, etched article and method for etched article |
WO2006126583A1 (ja) * | 2005-05-25 | 2006-11-30 | Daikin Industries, Ltd. | Bpsg膜とsod膜を含む基板のエッチング液 |
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1972
- 1972-09-22 JP JP9559272A patent/JPS4952799A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6162739A (en) * | 1998-02-11 | 2000-12-19 | Sez Semiconductor-Equipment Zubehor Fur Die Halbleiterfertigung Ag | Process for wet etching of semiconductor wafers |
US7052627B1 (en) | 1998-11-24 | 2006-05-30 | Daikin Industries, Ltd. | Etching solution, etched article and method for etched article |
WO2006126583A1 (ja) * | 2005-05-25 | 2006-11-30 | Daikin Industries, Ltd. | Bpsg膜とsod膜を含む基板のエッチング液 |