JPS4952799A - - Google Patents

Info

Publication number
JPS4952799A
JPS4952799A JP9559272A JP9559272A JPS4952799A JP S4952799 A JPS4952799 A JP S4952799A JP 9559272 A JP9559272 A JP 9559272A JP 9559272 A JP9559272 A JP 9559272A JP S4952799 A JPS4952799 A JP S4952799A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9559272A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9559272A priority Critical patent/JPS4952799A/ja
Publication of JPS4952799A publication Critical patent/JPS4952799A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Silicon Compounds (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
JP9559272A 1972-09-22 1972-09-22 Pending JPS4952799A (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9559272A JPS4952799A (cs) 1972-09-22 1972-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9559272A JPS4952799A (cs) 1972-09-22 1972-09-22

Publications (1)

Publication Number Publication Date
JPS4952799A true JPS4952799A (cs) 1974-05-22

Family

ID=14141834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9559272A Pending JPS4952799A (cs) 1972-09-22 1972-09-22

Country Status (1)

Country Link
JP (1) JPS4952799A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162739A (en) * 1998-02-11 2000-12-19 Sez Semiconductor-Equipment Zubehor Fur Die Halbleiterfertigung Ag Process for wet etching of semiconductor wafers
US7052627B1 (en) 1998-11-24 2006-05-30 Daikin Industries, Ltd. Etching solution, etched article and method for etched article
WO2006126583A1 (ja) * 2005-05-25 2006-11-30 Daikin Industries, Ltd. Bpsg膜とsod膜を含む基板のエッチング液

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162739A (en) * 1998-02-11 2000-12-19 Sez Semiconductor-Equipment Zubehor Fur Die Halbleiterfertigung Ag Process for wet etching of semiconductor wafers
US7052627B1 (en) 1998-11-24 2006-05-30 Daikin Industries, Ltd. Etching solution, etched article and method for etched article
WO2006126583A1 (ja) * 2005-05-25 2006-11-30 Daikin Industries, Ltd. Bpsg膜とsod膜を含む基板のエッチング液

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