JPS4950871A - - Google Patents

Info

Publication number
JPS4950871A
JPS4950871A JP5325873A JP5325873A JPS4950871A JP S4950871 A JPS4950871 A JP S4950871A JP 5325873 A JP5325873 A JP 5325873A JP 5325873 A JP5325873 A JP 5325873A JP S4950871 A JPS4950871 A JP S4950871A
Authority
JP
Japan
Prior art keywords
support member
semiconductor body
contacts
vitreous
metallized paths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5325873A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4950871A publication Critical patent/JPS4950871A/ja
Pending legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Joining Of Glass To Other Materials (AREA)
  • Measuring Magnetic Variables (AREA)
JP5325873A 1972-05-16 1973-05-15 Pending JPS4950871A (Direct)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25387972A 1972-05-16 1972-05-16

Publications (1)

Publication Number Publication Date
JPS4950871A true JPS4950871A (Direct) 1974-05-17

Family

ID=22962085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5325873A Pending JPS4950871A (Direct) 1972-05-16 1973-05-15

Country Status (6)

Country Link
US (1) US3781978A (Direct)
JP (1) JPS4950871A (Direct)
DE (1) DE2324030A1 (Direct)
FR (1) FR2230076B3 (Direct)
GB (1) GB1377930A (Direct)
IT (1) IT987625B (Direct)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953920A (en) * 1975-05-14 1976-05-04 International Telephone & Telegraph Corporation Method of making a transducer
US4142662A (en) * 1978-01-27 1979-03-06 Bell Telephone Laboratories, Incorporated Method of bonding microelectronic chips
JPS5787321A (en) 1980-11-21 1982-05-31 Nissan Motor Co Ltd Fusion-bonding method of skin material and foamed resin sheet
US4407440A (en) * 1981-02-23 1983-10-04 Mesa Technology Semiconductor die bonding machine
US5182424A (en) * 1989-10-31 1993-01-26 Vlastimil Frank Module encapsulation by induction heating
US5683601A (en) * 1994-10-24 1997-11-04 Panasonic Technologies, Inc. Laser ablation forward metal deposition with electrostatic assisted bonding
US5935462A (en) * 1994-10-24 1999-08-10 Matsushita Electric Industrial Co., Ltd. Repair of metal lines by electrostatically assisted laser ablative deposition
US5567336A (en) * 1994-10-24 1996-10-22 Matsushita Electric Industrial Co., Ltd. Laser ablation forward metal deposition with electrostatic assisted bonding
US6060127A (en) * 1998-03-31 2000-05-09 Matsushita Electric Industrial Co., Ltd. Mechanically restricted laser deposition
US6180912B1 (en) 1998-03-31 2001-01-30 Matsushita Electric Industrial Co., Ltd. Fan-out beams for repairing an open defect
US9776270B2 (en) * 2013-10-01 2017-10-03 Globalfoundries Inc. Chip joining by induction heating

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US27287A (en) * 1860-02-28 Pen hack
US3256598A (en) * 1963-07-25 1966-06-21 Martin Marietta Corp Diffusion bonding
GB1138401A (en) * 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
US3417459A (en) * 1965-05-06 1968-12-24 Mallory & Co Inc P R Bonding electrically conductive metals to insulators
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3506424A (en) * 1967-05-03 1970-04-14 Mallory & Co Inc P R Bonding an insulator to an insulator
US3589965A (en) * 1968-11-27 1971-06-29 Mallory & Co Inc P R Bonding an insulator to an insulator

Also Published As

Publication number Publication date
FR2230076B3 (Direct) 1976-04-30
US3781978A (en) 1974-01-01
DE2324030A1 (de) 1973-11-29
IT987625B (it) 1975-03-20
GB1377930A (en) 1974-12-18
FR2230076A1 (Direct) 1974-12-13

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