JPS4949577A - - Google Patents
Info
- Publication number
- JPS4949577A JPS4949577A JP47092696A JP9269672A JPS4949577A JP S4949577 A JPS4949577 A JP S4949577A JP 47092696 A JP47092696 A JP 47092696A JP 9269672 A JP9269672 A JP 9269672A JP S4949577 A JPS4949577 A JP S4949577A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47092696A JPS5149550B2 (en:Method) | 1972-09-14 | 1972-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47092696A JPS5149550B2 (en:Method) | 1972-09-14 | 1972-09-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4949577A true JPS4949577A (en:Method) | 1974-05-14 |
| JPS5149550B2 JPS5149550B2 (en:Method) | 1976-12-27 |
Family
ID=14061649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47092696A Expired JPS5149550B2 (en:Method) | 1972-09-14 | 1972-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5149550B2 (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55145349A (en) * | 1979-04-27 | 1980-11-12 | Toshiba Corp | Fabricating method of semiconductor device |
| JPS5753948A (en) * | 1980-09-17 | 1982-03-31 | Toshiba Corp | Mounting method of semiconductor element |
| JPH0662902A (ja) * | 1992-08-25 | 1994-03-08 | Daiwa Seiko Inc | スキー靴 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101565184B1 (ko) * | 2008-06-12 | 2015-11-02 | 미쓰비시 마테리알 가부시키가이샤 | 땜납 페이스트를 사용한 기판과 피탑재물의 접합 방법 |
-
1972
- 1972-09-14 JP JP47092696A patent/JPS5149550B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55145349A (en) * | 1979-04-27 | 1980-11-12 | Toshiba Corp | Fabricating method of semiconductor device |
| JPS5753948A (en) * | 1980-09-17 | 1982-03-31 | Toshiba Corp | Mounting method of semiconductor element |
| JPH0662902A (ja) * | 1992-08-25 | 1994-03-08 | Daiwa Seiko Inc | スキー靴 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5149550B2 (en:Method) | 1976-12-27 |