JPS4948264B1 - - Google Patents

Info

Publication number
JPS4948264B1
JPS4948264B1 JP9767370A JP9767370A JPS4948264B1 JP S4948264 B1 JPS4948264 B1 JP S4948264B1 JP 9767370 A JP9767370 A JP 9767370A JP 9767370 A JP9767370 A JP 9767370A JP S4948264 B1 JPS4948264 B1 JP S4948264B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9767370A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9767370A priority Critical patent/JPS4948264B1/ja
Priority to GB4950271A priority patent/GB1374626A/en
Priority to CA126342A priority patent/CA920721A/en
Priority to NL7114934A priority patent/NL7114934A/xx
Priority to US00193956A priority patent/US3729807A/en
Priority to FR717139077A priority patent/FR2111969B1/fr
Priority to DE19712154026 priority patent/DE2154026A1/de
Publication of JPS4948264B1 publication Critical patent/JPS4948264B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP9767370A 1970-10-30 1970-11-05 Pending JPS4948264B1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP9767370A JPS4948264B1 (de) 1970-11-05 1970-11-05
GB4950271A GB1374626A (en) 1970-10-30 1971-10-25 Method of making a semiconductor device
CA126342A CA920721A (en) 1970-10-30 1971-10-28 Method of making thermo-compression-bonded semiconductor device
NL7114934A NL7114934A (de) 1970-10-30 1971-10-29
US00193956A US3729807A (en) 1970-10-30 1971-10-29 Method of making thermo-compression-bonded semiconductor device
FR717139077A FR2111969B1 (de) 1970-10-30 1971-10-29
DE19712154026 DE2154026A1 (de) 1970-10-30 1971-10-29 Verfahren zum Herstellen von Halb leiterbauelementen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9767370A JPS4948264B1 (de) 1970-11-05 1970-11-05

Publications (1)

Publication Number Publication Date
JPS4948264B1 true JPS4948264B1 (de) 1974-12-20

Family

ID=14198523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9767370A Pending JPS4948264B1 (de) 1970-10-30 1970-11-05

Country Status (1)

Country Link
JP (1) JPS4948264B1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417267U (de) * 1977-07-06 1979-02-03
JPS5494955U (de) * 1977-12-15 1979-07-05
JPS5494954U (de) * 1977-12-15 1979-07-05
JPS60185181U (ja) * 1984-05-16 1985-12-07 株式会社　サンフアツシヨン シ−ト状保冷材
JPS6163677U (de) * 1984-09-28 1986-04-30

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417267U (de) * 1977-07-06 1979-02-03
JPS5494955U (de) * 1977-12-15 1979-07-05
JPS5494954U (de) * 1977-12-15 1979-07-05
JPS60185181U (ja) * 1984-05-16 1985-12-07 株式会社　サンフアツシヨン シ−ト状保冷材
JPS6163677U (de) * 1984-09-28 1986-04-30

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