JPS4945724Y2 - - Google Patents

Info

Publication number
JPS4945724Y2
JPS4945724Y2 JP1971082039U JP8203971U JPS4945724Y2 JP S4945724 Y2 JPS4945724 Y2 JP S4945724Y2 JP 1971082039 U JP1971082039 U JP 1971082039U JP 8203971 U JP8203971 U JP 8203971U JP S4945724 Y2 JPS4945724 Y2 JP S4945724Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1971082039U
Other languages
Japanese (ja)
Other versions
JPS4838768U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1971082039U priority Critical patent/JPS4945724Y2/ja
Publication of JPS4838768U publication Critical patent/JPS4838768U/ja
Application granted granted Critical
Publication of JPS4945724Y2 publication Critical patent/JPS4945724Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68Shapes or dispositions thereof
    • H10W70/682Shapes or dispositions thereof comprising holes having chips therein

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1971082039U 1971-09-08 1971-09-08 Expired JPS4945724Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971082039U JPS4945724Y2 (https=) 1971-09-08 1971-09-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971082039U JPS4945724Y2 (https=) 1971-09-08 1971-09-08

Publications (2)

Publication Number Publication Date
JPS4838768U JPS4838768U (https=) 1973-05-14
JPS4945724Y2 true JPS4945724Y2 (https=) 1974-12-14

Family

ID=27989139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971082039U Expired JPS4945724Y2 (https=) 1971-09-08 1971-09-08

Country Status (1)

Country Link
JP (1) JPS4945724Y2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5180937A (ja) * 1975-01-13 1976-07-15 Hamasawa Kogyo Kk Denkikikinojudensochi
JPS51125220U (https=) * 1975-03-31 1976-10-09
JPS62139688A (ja) * 1985-12-13 1987-06-23 松下電工株式会社 自動車用電気かみそり
JPH0733379Y2 (ja) * 1988-05-16 1995-07-31 九州日立マクセル株式会社 充電式電気機器
CN121488602A (zh) * 2023-08-31 2026-02-06 安斯泰莫株式会社 半导体装置以及电力转换装置

Also Published As

Publication number Publication date
JPS4838768U (https=) 1973-05-14

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