JPS4945724Y2 - - Google Patents
Info
- Publication number
- JPS4945724Y2 JPS4945724Y2 JP1971082039U JP8203971U JPS4945724Y2 JP S4945724 Y2 JPS4945724 Y2 JP S4945724Y2 JP 1971082039 U JP1971082039 U JP 1971082039U JP 8203971 U JP8203971 U JP 8203971U JP S4945724 Y2 JPS4945724 Y2 JP S4945724Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
- H01L2924/15157—Top view
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971082039U JPS4945724Y2 (en:Method) | 1971-09-08 | 1971-09-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971082039U JPS4945724Y2 (en:Method) | 1971-09-08 | 1971-09-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4838768U JPS4838768U (en:Method) | 1973-05-14 |
| JPS4945724Y2 true JPS4945724Y2 (en:Method) | 1974-12-14 |
Family
ID=27989139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1971082039U Expired JPS4945724Y2 (en:Method) | 1971-09-08 | 1971-09-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4945724Y2 (en:Method) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5180937A (ja) * | 1975-01-13 | 1976-07-15 | Hamasawa Kogyo Kk | Denkikikinojudensochi |
| JPS51125220U (en:Method) * | 1975-03-31 | 1976-10-09 | ||
| JPS62139688A (ja) * | 1985-12-13 | 1987-06-23 | 松下電工株式会社 | 自動車用電気かみそり |
| JPH0733379Y2 (ja) * | 1988-05-16 | 1995-07-31 | 九州日立マクセル株式会社 | 充電式電気機器 |
| WO2025046874A1 (ja) * | 2023-08-31 | 2025-03-06 | 日立Astemo株式会社 | 半導体装置及び電力変換装置 |
-
1971
- 1971-09-08 JP JP1971082039U patent/JPS4945724Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4838768U (en:Method) | 1973-05-14 |