JPS4942827B2 - - Google Patents
Info
- Publication number
- JPS4942827B2 JPS4942827B2 JP46091304A JP9130471A JPS4942827B2 JP S4942827 B2 JPS4942827 B2 JP S4942827B2 JP 46091304 A JP46091304 A JP 46091304A JP 9130471 A JP9130471 A JP 9130471A JP S4942827 B2 JPS4942827 B2 JP S4942827B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46091304A JPS4942827B2 (pt) | 1971-11-15 | 1971-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46091304A JPS4942827B2 (pt) | 1971-11-15 | 1971-11-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4856065A JPS4856065A (pt) | 1973-08-07 |
| JPS4942827B2 true JPS4942827B2 (pt) | 1974-11-16 |
Family
ID=14022711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46091304A Expired JPS4942827B2 (pt) | 1971-11-15 | 1971-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4942827B2 (pt) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51137219U (pt) * | 1975-04-28 | 1976-11-05 | ||
| JPS62180990U (pt) * | 1986-05-07 | 1987-11-17 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2708191B2 (ja) * | 1988-09-20 | 1998-02-04 | 株式会社日立製作所 | 半導体装置 |
| JP6806436B2 (ja) * | 2015-11-19 | 2021-01-06 | マクセルホールディングス株式会社 | 半導体装置用基板とその製造方法、および半導体装置 |
-
1971
- 1971-11-15 JP JP46091304A patent/JPS4942827B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51137219U (pt) * | 1975-04-28 | 1976-11-05 | ||
| JPS62180990U (pt) * | 1986-05-07 | 1987-11-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4856065A (pt) | 1973-08-07 |