JPS4942827B2 - - Google Patents

Info

Publication number
JPS4942827B2
JPS4942827B2 JP46091304A JP9130471A JPS4942827B2 JP S4942827 B2 JPS4942827 B2 JP S4942827B2 JP 46091304 A JP46091304 A JP 46091304A JP 9130471 A JP9130471 A JP 9130471A JP S4942827 B2 JPS4942827 B2 JP S4942827B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP46091304A
Other languages
Japanese (ja)
Other versions
JPS4856065A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46091304A priority Critical patent/JPS4942827B2/ja
Publication of JPS4856065A publication Critical patent/JPS4856065A/ja
Publication of JPS4942827B2 publication Critical patent/JPS4942827B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP46091304A 1971-11-15 1971-11-15 Expired JPS4942827B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP46091304A JPS4942827B2 (enrdf_load_stackoverflow) 1971-11-15 1971-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46091304A JPS4942827B2 (enrdf_load_stackoverflow) 1971-11-15 1971-11-15

Publications (2)

Publication Number Publication Date
JPS4856065A JPS4856065A (enrdf_load_stackoverflow) 1973-08-07
JPS4942827B2 true JPS4942827B2 (enrdf_load_stackoverflow) 1974-11-16

Family

ID=14022711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46091304A Expired JPS4942827B2 (enrdf_load_stackoverflow) 1971-11-15 1971-11-15

Country Status (1)

Country Link
JP (1) JPS4942827B2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137219U (enrdf_load_stackoverflow) * 1975-04-28 1976-11-05
JPS62180990U (enrdf_load_stackoverflow) * 1986-05-07 1987-11-17

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
JP6806436B2 (ja) * 2015-11-19 2021-01-06 マクセルホールディングス株式会社 半導体装置用基板とその製造方法、および半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137219U (enrdf_load_stackoverflow) * 1975-04-28 1976-11-05
JPS62180990U (enrdf_load_stackoverflow) * 1986-05-07 1987-11-17

Also Published As

Publication number Publication date
JPS4856065A (enrdf_load_stackoverflow) 1973-08-07

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