JPS4939223B1 - - Google Patents
Info
- Publication number
- JPS4939223B1 JPS4939223B1 JP9612870A JP9612870A JPS4939223B1 JP S4939223 B1 JPS4939223 B1 JP S4939223B1 JP 9612870 A JP9612870 A JP 9612870A JP 9612870 A JP9612870 A JP 9612870A JP S4939223 B1 JPS4939223 B1 JP S4939223B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9612870A JPS4939223B1 (de) | 1970-10-30 | 1970-10-30 | |
GB4950271A GB1374626A (en) | 1970-10-30 | 1971-10-25 | Method of making a semiconductor device |
AU34973/71A AU454608B2 (en) | 1970-10-30 | 1971-10-25 | Method of making thermo compression bonded semiconductor device |
CA126342A CA920721A (en) | 1970-10-30 | 1971-10-28 | Method of making thermo-compression-bonded semiconductor device |
DE19712154026 DE2154026A1 (de) | 1970-10-30 | 1971-10-29 | Verfahren zum Herstellen von Halb leiterbauelementen |
US00193956A US3729807A (en) | 1970-10-30 | 1971-10-29 | Method of making thermo-compression-bonded semiconductor device |
NL7114934A NL7114934A (de) | 1970-10-30 | 1971-10-29 | |
FR717139077A FR2111969B1 (de) | 1970-10-30 | 1971-10-29 | |
IT7057371A IT940089B (it) | 1970-10-30 | 1971-10-29 | Procedimento per fabbricare disposi tivi semiconduttori fissati per termocompressione |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9612870A JPS4939223B1 (de) | 1970-10-30 | 1970-10-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4939223B1 true JPS4939223B1 (de) | 1974-10-24 |
Family
ID=14156730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9612870A Pending JPS4939223B1 (de) | 1970-10-30 | 1970-10-30 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS4939223B1 (de) |
AU (1) | AU454608B2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51135138A (en) * | 1975-05-19 | 1976-11-24 | Yoshinori Hiraoka | Splicing and fastening apparatus for continuous corrugated roofing |
JPS5564334U (de) * | 1979-11-01 | 1980-05-02 |
-
1970
- 1970-10-30 JP JP9612870A patent/JPS4939223B1/ja active Pending
-
1971
- 1971-10-25 AU AU34973/71A patent/AU454608B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51135138A (en) * | 1975-05-19 | 1976-11-24 | Yoshinori Hiraoka | Splicing and fastening apparatus for continuous corrugated roofing |
JPS5564334U (de) * | 1979-11-01 | 1980-05-02 |
Also Published As
Publication number | Publication date |
---|---|
AU454608B2 (en) | 1974-10-31 |
AU3497371A (en) | 1973-05-03 |