JPS49390B1 - - Google Patents

Info

Publication number
JPS49390B1
JPS49390B1 JP45073104A JP7310470A JPS49390B1 JP S49390 B1 JPS49390 B1 JP S49390B1 JP 45073104 A JP45073104 A JP 45073104A JP 7310470 A JP7310470 A JP 7310470A JP S49390 B1 JPS49390 B1 JP S49390B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45073104A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS49390B1 publication Critical patent/JPS49390B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/959—Mechanical polishing of wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
JP45073104A 1969-11-20 1970-08-20 Pending JPS49390B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87832069A 1969-11-20 1969-11-20

Publications (1)

Publication Number Publication Date
JPS49390B1 true JPS49390B1 (ja) 1974-01-07

Family

ID=25371790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45073104A Pending JPS49390B1 (ja) 1969-11-20 1970-08-20

Country Status (3)

Country Link
US (1) US3669774A (ja)
JP (1) JPS49390B1 (ja)
DE (1) DE2035384A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4089735A (en) * 1968-06-05 1978-05-16 Siemens Aktiengesellschaft Method for epitactic precipitation of crystalline material from a gaseous phase, particularly for semiconductors
US6076652A (en) 1971-04-16 2000-06-20 Texas Instruments Incorporated Assembly line system and apparatus controlling transfer of a workpiece
US3900363A (en) * 1972-11-15 1975-08-19 Nippon Columbia Method of making crystal
US4040892A (en) * 1976-04-12 1977-08-09 General Electric Company Method of etching materials including a major constituent of tin oxide
NL7906996A (nl) * 1979-09-20 1981-03-24 Philips Nv Werkwijze voor het reinigen van een reaktor.
US4310380A (en) * 1980-04-07 1982-01-12 Bell Telephone Laboratories, Incorporated Plasma etching of silicon
JPS57190320A (en) * 1981-05-20 1982-11-22 Toshiba Corp Dry etching method
US4498953A (en) * 1983-07-27 1985-02-12 At&T Bell Laboratories Etching techniques
JP2669460B2 (ja) * 1986-10-29 1997-10-27 株式会社日立製作所 エツチング方法
DE3752259T2 (de) * 1986-12-19 1999-10-14 Applied Materials Bromine-Ätzverfahren für Silizium
GB2218567A (en) * 1988-05-13 1989-11-15 Philips Electronic Associated A method of forming an epitaxial layer of silicon
US4885056A (en) * 1988-09-02 1989-12-05 Motorola Inc. Method of reducing defects on semiconductor wafers
JPH0864559A (ja) * 1994-06-14 1996-03-08 Fsi Internatl Inc 基板面から不要な物質を除去する方法
US6124211A (en) * 1994-06-14 2000-09-26 Fsi International, Inc. Cleaning method
US5534107A (en) * 1994-06-14 1996-07-09 Fsi International UV-enhanced dry stripping of silicon nitride films
US5635102A (en) 1994-09-28 1997-06-03 Fsi International Highly selective silicon oxide etching method
DE19506118C1 (de) * 1995-02-22 1996-08-14 Karlsruhe Forschzent Verfahren zum plasmalosen Ätzen eines Silicium-Substrats
US7776228B2 (en) * 2006-04-11 2010-08-17 Ebara Corporation Catalyst-aided chemical processing method
US8734661B2 (en) 2007-10-15 2014-05-27 Ebara Corporation Flattening method and flattening apparatus

Also Published As

Publication number Publication date
US3669774A (en) 1972-06-13
DE2035384A1 (de) 1971-05-27

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