JPS4935488A - - Google Patents
Info
- Publication number
- JPS4935488A JPS4935488A JP7965272A JP7965272A JPS4935488A JP S4935488 A JPS4935488 A JP S4935488A JP 7965272 A JP7965272 A JP 7965272A JP 7965272 A JP7965272 A JP 7965272A JP S4935488 A JPS4935488 A JP S4935488A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Organic Insulating Materials (AREA)
- Sealing Material Composition (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Paints Or Removers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7965272A JPS5137116B2 (en) | 1972-08-09 | 1972-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7965272A JPS5137116B2 (en) | 1972-08-09 | 1972-08-09 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5361176A Division JPS528091A (en) | 1976-05-10 | 1976-05-10 | Process for producing thermosetting resins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4935488A true JPS4935488A (en) | 1974-04-02 |
| JPS5137116B2 JPS5137116B2 (en) | 1976-10-13 |
Family
ID=13696044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7965272A Expired JPS5137116B2 (en) | 1972-08-09 | 1972-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5137116B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019146105A1 (en) * | 2018-01-29 | 2019-08-01 | 日立化成株式会社 | Thermosetting resin composition, interlayer insulating resin film, composite film, printed circuit board, and semiconductor package |
| WO2019146797A1 (en) * | 2018-01-29 | 2019-08-01 | 日立化成株式会社 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and semiconductor package |
| JP2021109941A (en) * | 2020-01-15 | 2021-08-02 | 信越化学工業株式会社 | Low dielectric resin composition |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5230820U (en) * | 1975-08-23 | 1977-03-04 |
-
1972
- 1972-08-09 JP JP7965272A patent/JPS5137116B2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019146105A1 (en) * | 2018-01-29 | 2019-08-01 | 日立化成株式会社 | Thermosetting resin composition, interlayer insulating resin film, composite film, printed circuit board, and semiconductor package |
| WO2019146797A1 (en) * | 2018-01-29 | 2019-08-01 | 日立化成株式会社 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and semiconductor package |
| JPWO2019146797A1 (en) * | 2018-01-29 | 2021-01-07 | 昭和電工マテリアルズ株式会社 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board and semiconductor package |
| JPWO2019146105A1 (en) * | 2018-01-29 | 2021-01-28 | 昭和電工マテリアルズ株式会社 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board and semiconductor package |
| TWI805682B (en) * | 2018-01-29 | 2023-06-21 | 日商力森諾科股份有限公司 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and semiconductor package |
| JP2021109941A (en) * | 2020-01-15 | 2021-08-02 | 信越化学工業株式会社 | Low dielectric resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5137116B2 (en) | 1976-10-13 |