JPS4928272A - - Google Patents

Info

Publication number
JPS4928272A
JPS4928272A JP47068831A JP6883172A JPS4928272A JP S4928272 A JPS4928272 A JP S4928272A JP 47068831 A JP47068831 A JP 47068831A JP 6883172 A JP6883172 A JP 6883172A JP S4928272 A JPS4928272 A JP S4928272A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47068831A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47068831A priority Critical patent/JPS4928272A/ja
Publication of JPS4928272A publication Critical patent/JPS4928272A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/05Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/0198Manufacture or treatment batch processes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces

Landscapes

  • Wire Bonding (AREA)
JP47068831A 1972-07-10 1972-07-10 Pending JPS4928272A (show.php)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47068831A JPS4928272A (show.php) 1972-07-10 1972-07-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47068831A JPS4928272A (show.php) 1972-07-10 1972-07-10

Publications (1)

Publication Number Publication Date
JPS4928272A true JPS4928272A (show.php) 1974-03-13

Family

ID=13385025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47068831A Pending JPS4928272A (show.php) 1972-07-10 1972-07-10

Country Status (1)

Country Link
JP (1) JPS4928272A (show.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5845201A (ja) * 1981-09-10 1983-03-16 Daicel Chem Ind Ltd カルボキシメチルセルロ−ズエ−テルアルカリ塩の製法
JPS63136641A (ja) * 1986-11-28 1988-06-08 Toppan Printing Co Ltd 集積回路チツプ実装体及び集積回路チツプ実装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5845201A (ja) * 1981-09-10 1983-03-16 Daicel Chem Ind Ltd カルボキシメチルセルロ−ズエ−テルアルカリ塩の製法
JPS63136641A (ja) * 1986-11-28 1988-06-08 Toppan Printing Co Ltd 集積回路チツプ実装体及び集積回路チツプ実装方法

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