JPS4927544A - - Google Patents

Info

Publication number
JPS4927544A
JPS4927544A JP47069467A JP6946772A JPS4927544A JP S4927544 A JPS4927544 A JP S4927544A JP 47069467 A JP47069467 A JP 47069467A JP 6946772 A JP6946772 A JP 6946772A JP S4927544 A JPS4927544 A JP S4927544A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47069467A
Other languages
Japanese (ja)
Other versions
JPS5125070B2 (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47069467A priority Critical patent/JPS5125070B2/ja
Priority to GB3213673A priority patent/GB1421638A/en
Priority to US00377123A priority patent/US3817902A/en
Priority to DE19732335309 priority patent/DE2335309A1/de
Publication of JPS4927544A publication Critical patent/JPS4927544A/ja
Publication of JPS5125070B2 publication Critical patent/JPS5125070B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
JP47069467A 1972-07-11 1972-07-11 Expired JPS5125070B2 (cg-RX-API-DMAC10.html)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP47069467A JPS5125070B2 (cg-RX-API-DMAC10.html) 1972-07-11 1972-07-11
GB3213673A GB1421638A (en) 1972-07-11 1973-07-05 Silicone resin compositions
US00377123A US3817902A (en) 1972-07-11 1973-07-06 Silicone resin compositions
DE19732335309 DE2335309A1 (de) 1972-07-11 1973-07-11 Silikonmassen und deren verwendung zur herstellung von formkoerpern und verbundstoffen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47069467A JPS5125070B2 (cg-RX-API-DMAC10.html) 1972-07-11 1972-07-11

Publications (2)

Publication Number Publication Date
JPS4927544A true JPS4927544A (cg-RX-API-DMAC10.html) 1974-03-12
JPS5125070B2 JPS5125070B2 (cg-RX-API-DMAC10.html) 1976-07-28

Family

ID=13403481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47069467A Expired JPS5125070B2 (cg-RX-API-DMAC10.html) 1972-07-11 1972-07-11

Country Status (4)

Country Link
US (1) US3817902A (cg-RX-API-DMAC10.html)
JP (1) JPS5125070B2 (cg-RX-API-DMAC10.html)
DE (1) DE2335309A1 (cg-RX-API-DMAC10.html)
GB (1) GB1421638A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008121012A (ja) * 2006-11-08 2008-05-29 Wacker Chemie Ag オルガノポリシロキサンの水性分散液の製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5567374U (cg-RX-API-DMAC10.html) * 1978-11-01 1980-05-09
JPS5770176A (en) * 1980-10-21 1982-04-30 Toray Silicone Co Ltd Oil-resistant gasket packing material
GB2332205B (en) * 1995-06-30 1999-10-06 Gen Electric Heat curable elastomeric compositions
US6824879B2 (en) * 1999-06-10 2004-11-30 Honeywell International Inc. Spin-on-glass anti-reflective coatings for photolithography
US8053159B2 (en) 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
US8901268B2 (en) 2004-08-03 2014-12-02 Ahila Krishnamoorthy Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
US20080157065A1 (en) * 2004-08-03 2008-07-03 Ahila Krishnamoorthy Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
US8642246B2 (en) 2007-02-26 2014-02-04 Honeywell International Inc. Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
JP4874891B2 (ja) * 2007-08-10 2012-02-15 富士フイルム株式会社 レンズの製造方法及びレンズ
KR101546222B1 (ko) * 2008-02-25 2015-08-20 허니웰 인터내셔널 인코포레이티드 공정가능한 무기 및 유기 중합체 배합물, 이의 제조방법 및 이의 용도
CN102516774B (zh) * 2011-12-07 2014-03-19 中国科学院过程工程研究所 改性硅树脂基体的制备方法及其应用

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008121012A (ja) * 2006-11-08 2008-05-29 Wacker Chemie Ag オルガノポリシロキサンの水性分散液の製造方法

Also Published As

Publication number Publication date
US3817902A (en) 1974-06-18
GB1421638A (en) 1976-01-21
DE2335309A1 (de) 1974-01-31
JPS5125070B2 (cg-RX-API-DMAC10.html) 1976-07-28

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