JPS4924071A - - Google Patents
Info
- Publication number
- JPS4924071A JPS4924071A JP6384672A JP6384672A JPS4924071A JP S4924071 A JPS4924071 A JP S4924071A JP 6384672 A JP6384672 A JP 6384672A JP 6384672 A JP6384672 A JP 6384672A JP S4924071 A JPS4924071 A JP S4924071A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6384672A JPS555701B2 (cg-RX-API-DMAC7.html) | 1972-06-26 | 1972-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6384672A JPS555701B2 (cg-RX-API-DMAC7.html) | 1972-06-26 | 1972-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4924071A true JPS4924071A (cg-RX-API-DMAC7.html) | 1974-03-04 |
| JPS555701B2 JPS555701B2 (cg-RX-API-DMAC7.html) | 1980-02-08 |
Family
ID=13241093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6384672A Expired JPS555701B2 (cg-RX-API-DMAC7.html) | 1972-06-26 | 1972-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS555701B2 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51126067A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Resin sealing form semi-conductor equipment |
| JPS5360762U (cg-RX-API-DMAC7.html) * | 1976-10-25 | 1978-05-23 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4421066Y1 (cg-RX-API-DMAC7.html) * | 1966-07-20 | 1969-09-08 | ||
| JPS4710167U (cg-RX-API-DMAC7.html) * | 1971-02-24 | 1972-10-06 |
-
1972
- 1972-06-26 JP JP6384672A patent/JPS555701B2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4421066Y1 (cg-RX-API-DMAC7.html) * | 1966-07-20 | 1969-09-08 | ||
| JPS4710167U (cg-RX-API-DMAC7.html) * | 1971-02-24 | 1972-10-06 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51126067A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Resin sealing form semi-conductor equipment |
| JPS5360762U (cg-RX-API-DMAC7.html) * | 1976-10-25 | 1978-05-23 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS555701B2 (cg-RX-API-DMAC7.html) | 1980-02-08 |