JPS4922866A - - Google Patents

Info

Publication number
JPS4922866A
JPS4922866A JP6194472A JP6194472A JPS4922866A JP S4922866 A JPS4922866 A JP S4922866A JP 6194472 A JP6194472 A JP 6194472A JP 6194472 A JP6194472 A JP 6194472A JP S4922866 A JPS4922866 A JP S4922866A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6194472A
Other languages
Japanese (ja)
Other versions
JPS5113619B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6194472A priority Critical patent/JPS5113619B2/ja
Publication of JPS4922866A publication Critical patent/JPS4922866A/ja
Publication of JPS5113619B2 publication Critical patent/JPS5113619B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP6194472A 1972-06-20 1972-06-20 Expired JPS5113619B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6194472A JPS5113619B2 (enrdf_load_stackoverflow) 1972-06-20 1972-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6194472A JPS5113619B2 (enrdf_load_stackoverflow) 1972-06-20 1972-06-20

Publications (2)

Publication Number Publication Date
JPS4922866A true JPS4922866A (enrdf_load_stackoverflow) 1974-02-28
JPS5113619B2 JPS5113619B2 (enrdf_load_stackoverflow) 1976-05-01

Family

ID=13185790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6194472A Expired JPS5113619B2 (enrdf_load_stackoverflow) 1972-06-20 1972-06-20

Country Status (1)

Country Link
JP (1) JPS5113619B2 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50105366U (enrdf_load_stackoverflow) * 1974-02-04 1975-08-29
JPS5238885A (en) * 1975-09-22 1977-03-25 Nec Home Electronics Ltd Method for production of semiconductor device
JPS5562047U (enrdf_load_stackoverflow) * 1978-10-18 1980-04-26
CN104659011A (zh) * 2013-11-20 2015-05-27 西安永电电气有限责任公司 一种igbt模块的芯片焊接结构

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217141A (ja) * 1984-04-12 1985-10-30 太陽工業株式会社 膜面構造物における膜体の粉飾方法及び構造
JPS6128810U (ja) * 1984-07-26 1986-02-21 紹栄 新里 ほろ移動装置
JPH0274415U (enrdf_load_stackoverflow) * 1988-11-29 1990-06-07

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50105366U (enrdf_load_stackoverflow) * 1974-02-04 1975-08-29
JPS5238885A (en) * 1975-09-22 1977-03-25 Nec Home Electronics Ltd Method for production of semiconductor device
JPS5562047U (enrdf_load_stackoverflow) * 1978-10-18 1980-04-26
CN104659011A (zh) * 2013-11-20 2015-05-27 西安永电电气有限责任公司 一种igbt模块的芯片焊接结构

Also Published As

Publication number Publication date
JPS5113619B2 (enrdf_load_stackoverflow) 1976-05-01

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