JPS4922440A - - Google Patents
Info
- Publication number
- JPS4922440A JPS4922440A JP6235772A JP6235772A JPS4922440A JP S4922440 A JPS4922440 A JP S4922440A JP 6235772 A JP6235772 A JP 6235772A JP 6235772 A JP6235772 A JP 6235772A JP S4922440 A JPS4922440 A JP S4922440A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6235772A JPS5319019B2 (en:Method) | 1972-06-23 | 1972-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6235772A JPS5319019B2 (en:Method) | 1972-06-23 | 1972-06-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4922440A true JPS4922440A (en:Method) | 1974-02-27 |
| JPS5319019B2 JPS5319019B2 (en:Method) | 1978-06-19 |
Family
ID=13197768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6235772A Expired JPS5319019B2 (en:Method) | 1972-06-23 | 1972-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5319019B2 (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5428344A (en) * | 1977-08-05 | 1979-03-02 | Koito Mfg Co Ltd | Adhesive composition for bonding thermoplastic resin film and copper foil * and use thereof |
| JPH06114119A (ja) * | 1992-10-02 | 1994-04-26 | Mitsugi Iwasa | 非常梯子装置 |
-
1972
- 1972-06-23 JP JP6235772A patent/JPS5319019B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5428344A (en) * | 1977-08-05 | 1979-03-02 | Koito Mfg Co Ltd | Adhesive composition for bonding thermoplastic resin film and copper foil * and use thereof |
| JPH06114119A (ja) * | 1992-10-02 | 1994-04-26 | Mitsugi Iwasa | 非常梯子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5319019B2 (en:Method) | 1978-06-19 |