JPS4915860U - - Google Patents

Info

Publication number
JPS4915860U
JPS4915860U JP5571172U JP5571172U JPS4915860U JP S4915860 U JPS4915860 U JP S4915860U JP 5571172 U JP5571172 U JP 5571172U JP 5571172 U JP5571172 U JP 5571172U JP S4915860 U JPS4915860 U JP S4915860U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5571172U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5571172U priority Critical patent/JPS4915860U/ja
Publication of JPS4915860U publication Critical patent/JPS4915860U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
JP5571172U 1972-05-12 1972-05-12 Pending JPS4915860U ( )

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5571172U JPS4915860U ( ) 1972-05-12 1972-05-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5571172U JPS4915860U ( ) 1972-05-12 1972-05-12

Publications (1)

Publication Number Publication Date
JPS4915860U true JPS4915860U ( ) 1974-02-09

Family

ID=27940156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5571172U Pending JPS4915860U ( ) 1972-05-12 1972-05-12

Country Status (1)

Country Link
JP (1) JPS4915860U ( )

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553592U ( ) * 1978-10-07 1980-04-10
JPH0441780U ( ) * 1990-07-31 1992-04-09
JP2004274087A (ja) * 2004-06-21 2004-09-30 Sanken Electric Co Ltd 半導体発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3621340A (en) * 1969-04-16 1971-11-16 Bell Telephone Labor Inc Gallium arsenide diode with up-converting phosphor coating
US3659136A (en) * 1969-04-16 1972-04-25 Bell Telephone Labor Inc Gallium arsenide junction diode-activated up-converting phosphor
JPS4842392A ( ) * 1971-10-01 1973-06-20

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3621340A (en) * 1969-04-16 1971-11-16 Bell Telephone Labor Inc Gallium arsenide diode with up-converting phosphor coating
US3659136A (en) * 1969-04-16 1972-04-25 Bell Telephone Labor Inc Gallium arsenide junction diode-activated up-converting phosphor
JPS4842392A ( ) * 1971-10-01 1973-06-20

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553592U ( ) * 1978-10-07 1980-04-10
JPH0441780U ( ) * 1990-07-31 1992-04-09
JP2004274087A (ja) * 2004-06-21 2004-09-30 Sanken Electric Co Ltd 半導体発光装置

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