JPS4915860U - - Google Patents
Info
- Publication number
- JPS4915860U JPS4915860U JP5571172U JP5571172U JPS4915860U JP S4915860 U JPS4915860 U JP S4915860U JP 5571172 U JP5571172 U JP 5571172U JP 5571172 U JP5571172 U JP 5571172U JP S4915860 U JPS4915860 U JP S4915860U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5571172U JPS4915860U ( ) | 1972-05-12 | 1972-05-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5571172U JPS4915860U ( ) | 1972-05-12 | 1972-05-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4915860U true JPS4915860U ( ) | 1974-02-09 |
Family
ID=27940156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5571172U Pending JPS4915860U ( ) | 1972-05-12 | 1972-05-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4915860U ( ) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5553592U ( ) * | 1978-10-07 | 1980-04-10 | ||
JPH0441780U ( ) * | 1990-07-31 | 1992-04-09 | ||
JP2004274087A (ja) * | 2004-06-21 | 2004-09-30 | Sanken Electric Co Ltd | 半導体発光装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3621340A (en) * | 1969-04-16 | 1971-11-16 | Bell Telephone Labor Inc | Gallium arsenide diode with up-converting phosphor coating |
US3659136A (en) * | 1969-04-16 | 1972-04-25 | Bell Telephone Labor Inc | Gallium arsenide junction diode-activated up-converting phosphor |
JPS4842392A ( ) * | 1971-10-01 | 1973-06-20 |
-
1972
- 1972-05-12 JP JP5571172U patent/JPS4915860U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3621340A (en) * | 1969-04-16 | 1971-11-16 | Bell Telephone Labor Inc | Gallium arsenide diode with up-converting phosphor coating |
US3659136A (en) * | 1969-04-16 | 1972-04-25 | Bell Telephone Labor Inc | Gallium arsenide junction diode-activated up-converting phosphor |
JPS4842392A ( ) * | 1971-10-01 | 1973-06-20 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5553592U ( ) * | 1978-10-07 | 1980-04-10 | ||
JPH0441780U ( ) * | 1990-07-31 | 1992-04-09 | ||
JP2004274087A (ja) * | 2004-06-21 | 2004-09-30 | Sanken Electric Co Ltd | 半導体発光装置 |