JPS4913660Y1 - - Google Patents

Info

Publication number
JPS4913660Y1
JPS4913660Y1 JP1969055882U JP5588269U JPS4913660Y1 JP S4913660 Y1 JPS4913660 Y1 JP S4913660Y1 JP 1969055882 U JP1969055882 U JP 1969055882U JP 5588269 U JP5588269 U JP 5588269U JP S4913660 Y1 JPS4913660 Y1 JP S4913660Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1969055882U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1969055882U priority Critical patent/JPS4913660Y1/ja
Priority to GB1296744D priority patent/GB1296744A/en
Priority to US43787A priority patent/US3644798A/en
Priority to DE19702028821 priority patent/DE2028821B2/de
Priority to FR707021899A priority patent/FR2047890B1/fr
Publication of JPS4913660Y1 publication Critical patent/JPS4913660Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W76/134
    • H10W40/10
    • H10W76/157
    • H10W72/5522
    • H10W72/5524
    • H10W72/884
    • H10W90/737
    • H10W90/756
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating
JP1969055882U 1969-06-16 1969-06-16 Expired JPS4913660Y1 (enExample)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1969055882U JPS4913660Y1 (enExample) 1969-06-16 1969-06-16
GB1296744D GB1296744A (enExample) 1969-06-16 1970-06-04
US43787A US3644798A (en) 1969-06-16 1970-06-05 High-power integrated circuit ceramic package with metallic heat-conducting body
DE19702028821 DE2028821B2 (de) 1969-06-16 1970-06-11 Gehaeuse fuer ein halbleiterbauelement
FR707021899A FR2047890B1 (enExample) 1969-06-16 1970-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1969055882U JPS4913660Y1 (enExample) 1969-06-16 1969-06-16

Publications (1)

Publication Number Publication Date
JPS4913660Y1 true JPS4913660Y1 (enExample) 1974-04-04

Family

ID=13011453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1969055882U Expired JPS4913660Y1 (enExample) 1969-06-16 1969-06-16

Country Status (5)

Country Link
US (1) US3644798A (enExample)
JP (1) JPS4913660Y1 (enExample)
DE (1) DE2028821B2 (enExample)
FR (1) FR2047890B1 (enExample)
GB (1) GB1296744A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device
US3836825A (en) * 1972-10-06 1974-09-17 Rca Corp Heat dissipation for power integrated circuit devices
US4262300A (en) * 1978-11-03 1981-04-14 Isotronics, Inc. Microcircuit package formed of multi-components
DE3231389A1 (de) * 1981-08-29 1983-03-10 Robert Bosch Gmbh, 7000 Stuttgart Gleichrichteranordnung mit einem halbleiter-diodenplaettchen
US5650593A (en) * 1994-05-26 1997-07-22 Amkor Electronics, Inc. Thermally enhanced chip carrier package
US5640045A (en) * 1996-02-06 1997-06-17 Directed Energy, Inc. Thermal stress minimization in power semiconductor devices
US6020628A (en) * 1997-07-21 2000-02-01 Olin Corporation Optical component package with a hermetic seal
US20110281136A1 (en) * 2010-05-14 2011-11-17 Jenq-Gong Duh Copper-manganese bonding structure for electronic packages
US9559036B1 (en) 2014-08-01 2017-01-31 Altera Corporation Integrated circuit package with plated heat spreader

Also Published As

Publication number Publication date
FR2047890A1 (enExample) 1971-03-19
DE2028821A1 (de) 1971-01-07
US3644798A (en) 1972-02-22
GB1296744A (enExample) 1972-11-15
FR2047890B1 (enExample) 1973-01-12
DE2028821B2 (de) 1976-01-22

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