JPS49135833A - - Google Patents

Info

Publication number
JPS49135833A
JPS49135833A JP12844173A JP12844173A JPS49135833A JP S49135833 A JPS49135833 A JP S49135833A JP 12844173 A JP12844173 A JP 12844173A JP 12844173 A JP12844173 A JP 12844173A JP S49135833 A JPS49135833 A JP S49135833A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12844173A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS49135833A publication Critical patent/JPS49135833A/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • C25D3/32Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/34Electroplating: Baths therefor from solutions of lead
    • C25D3/36Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP12844173A 1972-11-17 1973-11-16 Pending JPS49135833A (US08124317-20120228-C00026.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30735472A 1972-11-17 1972-11-17

Publications (1)

Publication Number Publication Date
JPS49135833A true JPS49135833A (US08124317-20120228-C00026.png) 1974-12-27

Family

ID=23189377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12844173A Pending JPS49135833A (US08124317-20120228-C00026.png) 1972-11-17 1973-11-16

Country Status (4)

Country Link
JP (1) JPS49135833A (US08124317-20120228-C00026.png)
DE (1) DE2356678A1 (US08124317-20120228-C00026.png)
FR (1) FR2207195B3 (US08124317-20120228-C00026.png)
GB (1) GB1438701A (US08124317-20120228-C00026.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001254194A (ja) * 2000-03-08 2001-09-18 Ishihara Chem Co Ltd 錫、鉛及び錫−鉛合金メッキ浴
WO2013046731A1 (ja) * 2011-09-29 2013-04-04 ユケン工業株式会社 スズめっき用酸性水系組成物

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2013241B (en) * 1977-11-16 1982-03-24 Dipsol Chem Electroplating bath for depositing tin or tin alloy with brightness
US4662999A (en) * 1985-06-26 1987-05-05 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001254194A (ja) * 2000-03-08 2001-09-18 Ishihara Chem Co Ltd 錫、鉛及び錫−鉛合金メッキ浴
WO2013046731A1 (ja) * 2011-09-29 2013-04-04 ユケン工業株式会社 スズめっき用酸性水系組成物
JP2013072133A (ja) * 2011-09-29 2013-04-22 Yuken Industry Co Ltd スズからなるめっき用酸性水系組成物
CN103154328A (zh) * 2011-09-29 2013-06-12 油研工业股份有限公司 锡电镀用酸性水基组合物

Also Published As

Publication number Publication date
DE2356678A1 (de) 1974-05-30
FR2207195B3 (US08124317-20120228-C00026.png) 1976-10-01
GB1438701A (en) 1976-06-09
FR2207195A1 (US08124317-20120228-C00026.png) 1974-06-14

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