JPS49125847A - - Google Patents
Info
- Publication number
- JPS49125847A JPS49125847A JP48038988A JP3898873A JPS49125847A JP S49125847 A JPS49125847 A JP S49125847A JP 48038988 A JP48038988 A JP 48038988A JP 3898873 A JP3898873 A JP 3898873A JP S49125847 A JPS49125847 A JP S49125847A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/281—Auxiliary members
- H10W72/287—Flow barriers
Landscapes
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48038988A JPS49125847A (https=) | 1973-04-05 | 1973-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48038988A JPS49125847A (https=) | 1973-04-05 | 1973-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS49125847A true JPS49125847A (https=) | 1974-12-02 |
Family
ID=12540508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48038988A Pending JPS49125847A (https=) | 1973-04-05 | 1973-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS49125847A (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5193762A (en) * | 1975-02-14 | 1976-08-17 | Sogosetsuzokutaino seizohoho | |
| JPS52144964A (en) * | 1975-04-02 | 1977-12-02 | Hitachi Ltd | Frame |
| JPS5496353A (en) * | 1977-12-26 | 1979-07-30 | Nec Home Electronics Ltd | Frame grid assembly |
| JPS592329A (ja) * | 1982-06-29 | 1984-01-07 | Hitachi Ltd | 半導体集積回路基板の製造方法 |
-
1973
- 1973-04-05 JP JP48038988A patent/JPS49125847A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5193762A (en) * | 1975-02-14 | 1976-08-17 | Sogosetsuzokutaino seizohoho | |
| JPS52144964A (en) * | 1975-04-02 | 1977-12-02 | Hitachi Ltd | Frame |
| JPS5496353A (en) * | 1977-12-26 | 1979-07-30 | Nec Home Electronics Ltd | Frame grid assembly |
| JPS592329A (ja) * | 1982-06-29 | 1984-01-07 | Hitachi Ltd | 半導体集積回路基板の製造方法 |