JPS49125847A - - Google Patents

Info

Publication number
JPS49125847A
JPS49125847A JP3898873A JP3898873A JPS49125847A JP S49125847 A JPS49125847 A JP S49125847A JP 3898873 A JP3898873 A JP 3898873A JP 3898873 A JP3898873 A JP 3898873A JP S49125847 A JPS49125847 A JP S49125847A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3898873A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3898873A priority Critical patent/JPS49125847A/ja
Publication of JPS49125847A publication Critical patent/JPS49125847A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP3898873A 1973-04-05 1973-04-05 Pending JPS49125847A (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3898873A JPS49125847A (enrdf_load_html_response) 1973-04-05 1973-04-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3898873A JPS49125847A (enrdf_load_html_response) 1973-04-05 1973-04-05

Publications (1)

Publication Number Publication Date
JPS49125847A true JPS49125847A (enrdf_load_html_response) 1974-12-02

Family

ID=12540508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3898873A Pending JPS49125847A (enrdf_load_html_response) 1973-04-05 1973-04-05

Country Status (1)

Country Link
JP (1) JPS49125847A (enrdf_load_html_response)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193762A (en) * 1975-02-14 1976-08-17 Sogosetsuzokutaino seizohoho
JPS52144964A (en) * 1975-04-02 1977-12-02 Hitachi Ltd Frame
JPS5496353A (en) * 1977-12-26 1979-07-30 Nec Home Electronics Ltd Frame grid assembly
JPS592329A (ja) * 1982-06-29 1984-01-07 Hitachi Ltd 半導体集積回路基板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193762A (en) * 1975-02-14 1976-08-17 Sogosetsuzokutaino seizohoho
JPS52144964A (en) * 1975-04-02 1977-12-02 Hitachi Ltd Frame
JPS5496353A (en) * 1977-12-26 1979-07-30 Nec Home Electronics Ltd Frame grid assembly
JPS592329A (ja) * 1982-06-29 1984-01-07 Hitachi Ltd 半導体集積回路基板の製造方法

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