JPS49117343A - - Google Patents
Info
- Publication number
- JPS49117343A JPS49117343A JP2973973A JP2973973A JPS49117343A JP S49117343 A JPS49117343 A JP S49117343A JP 2973973 A JP2973973 A JP 2973973A JP 2973973 A JP2973973 A JP 2973973A JP S49117343 A JPS49117343 A JP S49117343A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2973973A JPS5332355B2 (en) | 1973-03-14 | 1973-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2973973A JPS5332355B2 (en) | 1973-03-14 | 1973-03-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49117343A true JPS49117343A (en) | 1974-11-09 |
| JPS5332355B2 JPS5332355B2 (en) | 1978-09-07 |
Family
ID=12284461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2973973A Expired JPS5332355B2 (en) | 1973-03-14 | 1973-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5332355B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5238884A (en) * | 1975-09-23 | 1977-03-25 | Mitsubishi Electric Corp | Method of forming bump of flip chips |
| JPS53113367U (en) * | 1977-02-18 | 1978-09-09 | ||
| JPS53113368U (en) * | 1977-02-18 | 1978-09-09 | ||
| JPS53126163A (en) * | 1977-04-09 | 1978-11-04 | Chuo Meiban Kougiyou Kk | Method of mounting part lead or like in printed circuit board |
| US4894706A (en) * | 1985-02-14 | 1990-01-16 | Nippon Telegraph And Telephone Corporation | Three-dimensional packaging of semiconductor device chips |
-
1973
- 1973-03-14 JP JP2973973A patent/JPS5332355B2/ja not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5238884A (en) * | 1975-09-23 | 1977-03-25 | Mitsubishi Electric Corp | Method of forming bump of flip chips |
| JPS53113367U (en) * | 1977-02-18 | 1978-09-09 | ||
| JPS53113368U (en) * | 1977-02-18 | 1978-09-09 | ||
| JPS53126163A (en) * | 1977-04-09 | 1978-11-04 | Chuo Meiban Kougiyou Kk | Method of mounting part lead or like in printed circuit board |
| JPS5631757B2 (en) * | 1977-04-09 | 1981-07-23 | ||
| US4894706A (en) * | 1985-02-14 | 1990-01-16 | Nippon Telegraph And Telephone Corporation | Three-dimensional packaging of semiconductor device chips |
| WO1993013557A1 (en) * | 1985-02-14 | 1993-07-08 | Yoshiyuki Sato | Structure for mounting the semiconductor chips in a three-dimensional manner |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5332355B2 (en) | 1978-09-07 |