JPS49114357A - - Google Patents
Info
- Publication number
- JPS49114357A JPS49114357A JP2321173A JP2321173A JPS49114357A JP S49114357 A JPS49114357 A JP S49114357A JP 2321173 A JP2321173 A JP 2321173A JP 2321173 A JP2321173 A JP 2321173A JP S49114357 A JPS49114357 A JP S49114357A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2321173A JPS49114357A (enExample) | 1973-02-28 | 1973-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2321173A JPS49114357A (enExample) | 1973-02-28 | 1973-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS49114357A true JPS49114357A (enExample) | 1974-10-31 |
Family
ID=12104316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2321173A Pending JPS49114357A (enExample) | 1973-02-28 | 1973-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS49114357A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5485970U (enExample) * | 1977-11-30 | 1979-06-18 | ||
| JP2010040651A (ja) * | 2008-08-01 | 2010-02-18 | Fuji Electric Systems Co Ltd | 半導体装置およびその製造方法 |
-
1973
- 1973-02-28 JP JP2321173A patent/JPS49114357A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5485970U (enExample) * | 1977-11-30 | 1979-06-18 | ||
| JP2010040651A (ja) * | 2008-08-01 | 2010-02-18 | Fuji Electric Systems Co Ltd | 半導体装置およびその製造方法 |