JPS4911278A - - Google Patents

Info

Publication number
JPS4911278A
JPS4911278A JP47053167A JP5316772A JPS4911278A JP S4911278 A JPS4911278 A JP S4911278A JP 47053167 A JP47053167 A JP 47053167A JP 5316772 A JP5316772 A JP 5316772A JP S4911278 A JPS4911278 A JP S4911278A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47053167A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47053167A priority Critical patent/JPS4911278A/ja
Publication of JPS4911278A publication Critical patent/JPS4911278A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP47053167A 1972-05-29 1972-05-29 Pending JPS4911278A (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47053167A JPS4911278A (https=) 1972-05-29 1972-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47053167A JPS4911278A (https=) 1972-05-29 1972-05-29

Publications (1)

Publication Number Publication Date
JPS4911278A true JPS4911278A (https=) 1974-01-31

Family

ID=12935285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47053167A Pending JPS4911278A (https=) 1972-05-29 1972-05-29

Country Status (1)

Country Link
JP (1) JPS4911278A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52147774A (en) * 1976-06-04 1977-12-08 Stanley Electric Co Ltd Method of producing semiconductor unit
JPS60123522A (ja) * 1983-12-07 1985-07-02 Idemitsu Petrochem Co Ltd フエノ−ル系樹脂の変性剤

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52147774A (en) * 1976-06-04 1977-12-08 Stanley Electric Co Ltd Method of producing semiconductor unit
JPS60123522A (ja) * 1983-12-07 1985-07-02 Idemitsu Petrochem Co Ltd フエノ−ル系樹脂の変性剤

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