JPS49112570A - - Google Patents
Info
- Publication number
- JPS49112570A JPS49112570A JP48021284A JP2128473A JPS49112570A JP S49112570 A JPS49112570 A JP S49112570A JP 48021284 A JP48021284 A JP 48021284A JP 2128473 A JP2128473 A JP 2128473A JP S49112570 A JPS49112570 A JP S49112570A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48021284A JPS49112570A (enrdf_load_stackoverflow) | 1973-02-23 | 1973-02-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48021284A JPS49112570A (enrdf_load_stackoverflow) | 1973-02-23 | 1973-02-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS49112570A true JPS49112570A (enrdf_load_stackoverflow) | 1974-10-26 |
Family
ID=12050821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP48021284A Pending JPS49112570A (enrdf_load_stackoverflow) | 1973-02-23 | 1973-02-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS49112570A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008532292A (ja) * | 2005-02-24 | 2008-08-14 | アギア システムズ インコーポレーテッド | フリップ・チップ・デバイスを形成するための構造および方法 |
JP2009524922A (ja) * | 2006-01-24 | 2009-07-02 | エヌエックスピー ビー ヴィ | 半導体部品のための応力緩衝パッケージ |
-
1973
- 1973-02-23 JP JP48021284A patent/JPS49112570A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008532292A (ja) * | 2005-02-24 | 2008-08-14 | アギア システムズ インコーポレーテッド | フリップ・チップ・デバイスを形成するための構造および方法 |
JP2009524922A (ja) * | 2006-01-24 | 2009-07-02 | エヌエックスピー ビー ヴィ | 半導体部品のための応力緩衝パッケージ |
US8338967B2 (en) | 2006-01-24 | 2012-12-25 | Nxp B.V. | Stress buffering package for a semiconductor component |