JPS4911067A - - Google Patents
Info
- Publication number
- JPS4911067A JPS4911067A JP47051655A JP5165572A JPS4911067A JP S4911067 A JPS4911067 A JP S4911067A JP 47051655 A JP47051655 A JP 47051655A JP 5165572 A JP5165572 A JP 5165572A JP S4911067 A JPS4911067 A JP S4911067A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47051655A JPS4911067A (online.php) | 1972-05-26 | 1972-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47051655A JPS4911067A (online.php) | 1972-05-26 | 1972-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4911067A true JPS4911067A (online.php) | 1974-01-31 |
Family
ID=12892876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47051655A Pending JPS4911067A (online.php) | 1972-05-26 | 1972-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4911067A (online.php) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54149040U (online.php) * | 1978-04-10 | 1979-10-17 | ||
| JP2009283663A (ja) * | 2008-05-22 | 2009-12-03 | Powertech Technology Inc | 半導体パッケージ及びリードフレーム |
-
1972
- 1972-05-26 JP JP47051655A patent/JPS4911067A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54149040U (online.php) * | 1978-04-10 | 1979-10-17 | ||
| JP2009283663A (ja) * | 2008-05-22 | 2009-12-03 | Powertech Technology Inc | 半導体パッケージ及びリードフレーム |